Claims
- 1. A method of making a chip carrier comprising the following steps:
- providing a dielectric layer having a first surface and a dielectric constant of from about 1.5 to 3.5;
- forming a first layer of circuitry on said first surface of said dielectric layer;
- applying a conformational coating having a percent planarization of greater than about 30, to said first surface of said dielectric layer;
- forming at least one via in said conformational coating;
- forming fine line circuitry wherein said fine lines have a line width less than 1 mil and line spacing of 1.5 mil or less, on said conformational coating; and
- electrically connecting said fine line circuitry to said first layer of circuitry through said via.
- 2. The method of claim 1, wherein said first layer of circuitry is formed by laminating metallic foil to said dielectric layer, and subtractively etching said foil.
- 3. The method of claim 2 wherein applying said conformational coating includes forming a polyimide coating on said first surface of said dielectric layer.
- 4. The method of claim 1, wherein providing said dielectric layer comprises providing a layer of polytetrafluoroethylene.
- 5. The method of claim 1, wherein providing said dielectric layer further comprises filling said dielectric layer with a particulate filler free of woven fiberglass cloth.
- 6. The method of claim 1, wherein providing said dielectric layer further comprises the step of forming at least one plated through hole disposed through said dielectric layer.
- 7. The method of claim 6, wherein said forming said first layer of circuitry on said first surface of said dielectric layer further comprises the step of forming at least one pad disposed atop said plated through hole so as to make electrical and mechanical connection with said via.
CROSS REFERENCE TO COPENDING APPLICATION
This application is a divisional application of Ser. No. 08/790,245, filed Jan. 28, 1997, now U.S. Pat. No. 5,798,563.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
790245 |
Jan 1997 |
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