3128649

Information

• Patent Grant
• 3128649

• References
• Source

• Patent Number

  3,128,649

• Date Filed

  Not available

• Date Issued

  Tuesday, April 14, 1964
  60 years ago

• CPC

  • B23K20/005 - Capillary welding
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L24/85 - using a wire connector
  • B23K2201/32 - Wires
  • B23K2201/40 - Semiconductor devices
  • H01L24/45 - of an individual wire connector
  • H01L2224/45015 - being circular
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48137 - the bodies being arranged next to each other
  • H01L2224/4823 - connecting the wire to a pin of the item
  • H01L2224/48455 - Details of wedge bonds
  • H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/48699 - Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
  • H01L2224/78302 - Shape
  • H01L2224/78313 - Wedge
  • H01L2224/78315 - of the pressing surface
  • H01L2224/78318 - inside the capillary
  • H01L2224/85 - using a wire connector
  • H01L2224/85099 - Ambient temperature
  • H01L2224/85203 - Thermocompression bonding
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/0101 - Neon [Ne]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01022 - Titanium [Ti]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01056 - Barium [Ba]
  • H01L2924/01058 - Cerium [Ce]
  • H01L2924/01068 - Erbium [Er]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01088 - Radium [Ra]
  • H01L2924/014 - Solder alloys
  • H01L2924/19043 - being a resistor
  • H01L2924/20752 - larger or equal to 20 microns less than 30 microns
  • Y10S228/904 - Wire bonding

• US Classifications

  • 228 - Metal fusion bonding
  • 140 - Wireworking
  • 219 - Electric heating