Claims
- 1. A method of fabricating an integrated circuit, said method comprising the steps of:
- (a) forming at least one transistor at a frontside surface of a substrate:
- (b) forming at least one transmission line at said frontside surface:
- (c) forming an airbridge over portions of said transistor wherein a top surface of said airbridge is spaced from said frontside surface by a distance approximately equal to, or greater than, the thickness of said substrate;
- (d) forming a conducting via through said substrate coupling said at least one transistor to a bond pad at said backside surface; and
- (e) coupling a heatsink to said airbridge.
- 2. The method of claim 1, wherein said dielectric material is polyimide.
- 3. The method of claim 1, further comprising the step of forming a groundplane at said backside surface of said substrate.
- 4. The method of claim 1, wherein said heatsink comprises a dielectric.
- 5. The method of claim 4, wherein said dielectric is taken from the group consisting of AIN and BeO.
- 6. The method of claim 4, wherein said dielectric heatsink is coupled to a metal heatsink.
- 7. The method of claim 4, wherein said heatsink is metal.
RELATED APPLICATIONS
This is a divisional of application Ser. No. 08/339,429, filed Nov. 14, 1994, now U.S. Pat. No. 5,532,506, which is a continuation-in-part of U.S. application Ser. No. 08/298,822 filed Aug. 31, 1994, now U.S. Pat. No. 5,5231,406, by Hua-Quen Tserng and Paul Saunier for an invention entitled "High-Density Integrated Circuit." This application includes subject matter which is related to U.S. patent application Ser. No. 08/159,648, "Low Thermal Impedance Integrated Circuit,", filed Nov. 30, 1993.
US Referenced Citations (6)
Non-Patent Literature Citations (1)
Entry |
W. S. Wong, W. D. Gray, and D. C. Wang, "Flip Chip Manufacturing Technology for GaAs MMIC", Hughes Aircraft Company, Microelectronic Circuits Division, GaAs Mantech, Conf., pp. 224-227. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
339429 |
Nov 1994 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
298822 |
Aug 1994 |
|