3390012

Information

• Patent Grant
• 3390012

• References
• Source

• Patent Number

  3,390,012

• Date Filed

  Not available

• Date Issued

  Tuesday, June 25, 1968
  56 years ago

• CPC

  • H05K3/105 - by conversion of non-conductive material on or in the support into conductive material
  • H01B1/00 - Conductors or conductive bodies characterised by the conductive materials Selection of materials as conductors
  • H01B3/004 - with conductive additives or conductive layers
  • H01C7/001 - Mass resistors
  • H01C17/06 - adapted for coating resistive material on a base
  • H01F1/00 - Magnets or magnetic bodies characterised by the magnetic materials therefor Selection of materials for their magnetic properties
  • H01F1/0311 - Compounds
  • H01F1/0313 - Oxidic compounds
  • H01F1/346 - [(TO4) 3] with T= Si, Al, Fe, Ga
  • H01F41/34 - in patterns
  • H01G4/12 - Ceramic dielectrics
  • H01G4/1209 - characterised by the ceramic dielectric material
  • H01G13/06 - with provision of removing metal surfaces
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/4846 - Leads on or in insulating or insulated substrates
  • H01L21/56 - Encapsulations
  • H01L23/291 - Oxides or nitrides or carbides
  • H01L23/522 - including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/5227 - Inductive arrangements or effects of, or between, wiring layers
  • H01L23/5384 - Conductive vias through the substrate with or without pins
  • H01L24/81 - using a bump connector
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • H01L49/02 - Thin-film or thick-film devices
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01012 - Magnesium [Mg]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/0102 - Calcium [Ca]
  • H01L2924/01021 - Scandium [Sc]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01024 - Chromium [Cr]
  • H01L2924/01025 - Manganese [Mn]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/0103 - Zinc [Zn]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01044 - Ruthenium [Ru]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01049 - Indium [In]
  • H01L2924/01051 - Antimony [Sb]
  • H01L2924/01052 - Tellurium [Te]
  • H01L2924/01056 - Barium [Ba]
  • H01L2924/01057 - Lanthanum [La]
  • H01L2924/01058 - Cerium [Ce]
  • H01L2924/01068 - Erbium [Er]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01084 - Polonium [Po]
  • H01L2924/01088 - Radium [Ra]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12042 - LASER
  • H01L2924/14 - Integrated circuits
  • H01L2924/19041 - being a capacitor
  • H01L2924/19042 - being an inductor
  • H01L2924/19043 - being a resistor
  • H01L2924/30105 - Capacitance
  • H01L2924/30107 - Inductance
  • H01L2924/3025 - Electromagnetic shielding
  • H05K2203/092 - Particle beam
  • H05K2203/107 - Using laser light
  • H05K2203/1105 - Heating or thermal processing not related to soldering, firing, curing or laminating
  • H05K2203/125 - Inorganic compounds
  • Y10S148/026 - Deposition thru hole in mask
  • Y10S148/051 - Etching
  • Y10S148/071 - Heating, selective
  • Y10S148/085 - Isolated-integrated
  • Y10S148/106 - Masks, special
  • Y10S148/15 - Silicon on sapphire SOS
  • Y10S428/90 - Magnetic feature
  • Y10S430/143 - Electron beam
  • Y10T29/435 - Solid dielectric type

• US Classifications

  • 430 - Radiation imagery chemistry: process, composition, or product thereof
  • 029 - Metal working
  • 148 - Metal treatment
  • 174 - Electricity: conductors and insulators
  • 200 - Electricity: circuit makers and breakers
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 338 - Electrical resistors
  • 361 - Electricity: electrical systems and devices
  • 427 - Coating processes
  • 428 - Stock material or miscellaneous articles