Claims
- 1. A method for creating a circuit assembly comprising the steps of:providing a first electrically conductive member; creating at least one protuberance upon said first electrically conductive member; providing a second electrically conductive member; providing at least one pre-circuit assembly; and attaching said second electrically conductive member and said at least one pre-circuit assembly to said first electrically conductive member, thereby creating a multilayer circuit assembly and causing said at least one protuberance to extend within said multi-layer circuit assembly.
- 2. The method of claim 1 wherein said first electrically conductive member and said second electrically conductive member each comprise copper material.
- 3. The method of claim 1 wherein said step of attaching said second electrically conductive member and said at least one pre-circuit assembly to said first electrically conductive member comprises laminating said second electrically conductive member and said at least one pre-circuit assembly to said first electrically conductive member.
- 4. The method of claim 1 further comprising the steps of:selectively applying a dielectric material between said first and second electrically conductive members; and selectively applying tin material upon said at least one protuberance.
- 5. The method of claim 4 wherein said dielectric material comprises acrylic.
- 6. The method of claim 1 wherein said at least one protuberance is formed by selectively applying a certain electrically conductive material upon said first member.
- 7. The method of claim 6 wherein said step of selectively applying a certain electrically conductive material upon said first member comprises soldering said electrically conductive material upon said first member.
- 8. A method for creating a circuit assembly, said method comprising the steps of:providing a first electically conductive member; etching a plurality of portions of said first electrically conductive member without attaching said first electrically conductive member to any support member, thereby creating a plurality of protuberances upon said first electrically conductive member; providing a dielectric material; disposing said dielectric material within said plurality of etched portions of said first electrically conductive member; attaching a plurality of second electrically conductive members to said first electrically conductive member, thereby forming a multi-layer circuit assembly; and creating at least one interconnection path within said multi-layer circuit assembly by use of said plurality of protuberances.
- 9. The method of claim 8 wherein said step of creating a plurality of protuberances upon said first electrically conductive member further comprises the step of selectively applying solder upon said first electrically conductive member.
- 10. The method of claim 8 wherein each of said plurality of proturberances are substantially identical.
- 11. The method of claim 8 further comprising the step of selectively etching at least one of said plurality of second electrically conductive members to form at least one air-bridge.
- 12. The method of claim 11 further comprising the step of underfilling said at least one air-bridge with a certain material.
- 13. The method of claim 12 wherein said certain material is an acrylic material.
Parent Case Info
This application claims the benefit of Provisional Application No. 60/207,647, filed May 26, 2000.
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Provisional Applications (1)
|
Number |
Date |
Country |
|
60/207647 |
May 2000 |
US |