Number | Name | Date | Kind |
---|---|---|---|
5409865 | Karnezos | Apr 1995 | |
5420460 | Massingill | May 1995 | |
5474957 | Urushima | Dec 1995 | |
5482898 | Marrs | Jan 1996 | |
5556807 | Bhattacharyya et al. | Sep 1996 |
Entry |
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"Design of a Low Cost Wire Bond Tape Ball Grid Array (TBGA) Package", R.D. Schueller and A. P. Plepys, Surface Mount International Proceedings, Aug. 30, 1995, pp. 261-269. |
"An Overview of TBGA Bond and Assembly Operations", Michael Bernier, '95 Flip Chip, BGA, TAB & AP Symposium, 1995 Semiconductor Technology Center, Inc. no month. |