Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 H01L2225/04the devices not having separate containers H01L2225/065the devices being of a type provided for in group H01L27/00 H01L2225/06503Stacked arrangements of devices H01L2225/06506Wire or wire-like electrical connections between devices H01L2225/0651Wire or wire-like electrical connections from device to substrate H01L2225/06513Bump or bump-like direct electrical connections between devices H01L2225/06517Bump or bump-like direct electrical connections from device to substrate H01L2225/0652Bump or bump-like direct electrical connections from substrate to substrate H01L2225/06524Electrical connections formed on device or on substrate H01L2225/06527Special adaptation of electrical connections H01L2225/06531Non-galvanic coupling H01L2225/06534Optical coupling H01L2225/06537Electromagnetic shielding H01L2225/06541Conductive via connections through the device H01L2225/06544Design considerations for via connections H01L2225/06548Conductive via connections through the substrate, container, or encapsulation H01L2225/06551Conductive connections on the side of the device H01L2225/06555Geometry of the stack H01L2225/06558the devices having passive surfaces facing each other H01L2225/06562at least one device in the stack being rotated or offset H01L2225/06565the devices having the same size and there being no auxiliary carrier between the devices H01L2225/06568the devices decreasing in size H01L2225/06572Auxiliary carrier between devices, the carrier having an electrical connection structure H01L2225/06575Auxiliary carrier between devices, the carrier having no electrical connection structure H01L2225/06579TAB carriers beam leads H01L2225/06582Housing for the assembly H01L2225/06586Housing with external bump or bump-like connectors H01L2225/06589Thermal management H01L2225/06593Mounting aids permanently on device arrangements for alignment H01L2225/06596Structural arrangements for testing H01L2225/10the devices having separate containers H01L2225/1005the devices being of a type provided for in group H01L27/00 H01L2225/1011the containers being in a stacked arrangement H01L2225/1017the lowermost container comprising a device support H01L2225/1023the support being an insulating substrate H01L2225/1029the support being a lead frame H01L2225/1035the device being entirely enclosed by the support H01L2225/1041Special adaptations for top connections of the lowermost container H01L2225/1047Details of electrical connections between containers H01L2225/1052Wire or wire-like electrical connections H01L2225/1058Bump or bump-like electrical connections H01L2225/1064Electrical connections provided on a side surface of one or more of the containers H01L2225/107Indirect electrical connections H01L2225/1076Shape of the containers H01L2225/1082for improving alignment between containers H01L2225/1088Arrangements to limit the height of the assembly H01L2225/1094Thermal management