Yang et al., “Atomic Layer Deposition of Tungsten Film from WF6/B2H6: Nucleation Layer for Advanced Semiconductor Devices.” Advanced Metallization Conference 2001 (AMC 2001), Conference Proceedings ULSI XVII@2002 Materials Research Society, pp. 655-660. |
Bain et al., “Deposition of tungsten by plasma enhanced chemical vapour deposition,” J. Phys. IV France, vol. 9, pp. 827-833 (1991). |
Girolami et al., “Tailored Organometallics as Low-Temperature CVD Precursors to Thin Films,” Materials Research Society Symposium Proceedings, vol. 121, pp. 429-438 (1988). |
Jehn et al., “Gmelin Handbook of Inorganic and Organometallic Chemistry,” 8th Edition, vol. A 5b, No. 54, pp. 131-154 (1993). |
Lai et al., “Precursors for Organometallic Chemical Vapor Deposition of Tungsten Carbide Films,” Chem. Mater., vol. 7, pp. 2284-2292 (1995). |
Ludviksson et al., “Low-Temperature Thermal CVD of Ti-Al Metal Films Using a Strong Reducing Agent,” Chem. Vap. Deposition, vol. 4, No. 4, pp. 129-132, (1998). |
Min et al., “Atomic Layer Deposition of TiN Films by Alternate Supply of Tetrakis (ethylmethylamino)-Titanium and Ammonia,” Jpn. J. Appl. Phys., vol. 37, pp. 4999-5004 (1998). |
Min et al., “Atomic Layer Deposition of TiN Thin Films by Sequential Introduction of Ti Precursor and HN3,” Mat. Res. Soc. Sym. Proc., vol. 514, pp. 337-342 (1998). |
Nakajima et al., “Chemical Vapor Deposition of Tungsten Carbide, Molybdenum Carbide Nitride, and Molybdenum Nitride Films,” J. Electrochem. Soc., vol. 144, No. 6, pp. 2096-2100 (Jun. 1997). |
Polyakov et al., “Growth of GaBN Ternary Soloutions by Organometallic Vapor Phase Eitaxy,” Journal of Electronic Materials, Vo. 26, No. 3, pp. 237-242, (1997). |
Ritala et al., “Atomic Layer Epitaxy Growth of TiN Thin Films from Til4 and NH3,” J. Electrochem. Soc., vol. 145, No. 8, pp. 2914-2920 (Aug. 1998). |
Tulhoff et al., “Ullmann's Encyclopedia of Industrial Chemistry,” 5th, Completely Revised Edition, vol. A5, pp. 61-77 (1986). |
“Kirk-Othmer Encyclopedia of Chemical Technology,” 4th Edition, vol. 4, John Wiley & Sons, Inc., pp. 841-878 (1992). |