Claims
- 1. A semiconductor device comprising:a semiconductor chip having a square surface; a wiring substrate having a main surface thereof used for mounting said semiconductor chip; a first electrode formed on a first area of a main surface of said semiconductor chip and placed at a location in close proximity to a side of said semiconductor chip extending in a first direction; first amplifying means formed on said first area of said main surface of said semiconductor chip and provided with an input unit electrically connected to said first electrode; a second electrode formed on a second area of said main surface of said semiconductor chip and placed at a location in close proximity to said side of said semiconductor chip; second amplifying means formed on said second area of said main surface of said semiconductor chip and provided with an output unit electrically connected to said second electrode; a third electrode formed on a third area between said first and second areas of said main surface of said semiconductor chip; a fourth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said first electrode by a first wire; a fifth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said second electrode by a second wire; and a sixth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said third electrode by a third wire with an electric potential thereof fixed at a reference level, wherein said first to third wires extend in a second direction which is substantially perpendicular to said first direction, wherein said sixth electrode is placed at a location farther from said side of said semiconductor chip than said fourth and fifth electrodes in said second direction.
- 2. A semiconductor device according to claim 1, wherein said fourth electrode is placed at a distance from said side of said semiconductor chip about equal to a distance of said fifth electrode from said side of said semiconductor chip.
- 3. A semiconductor device according to claim 1, wherein an input unit of said second amplifying means is electrically connected to an output unit of said first amplifying means.
- 4. A semiconductor device according to claim 1, wherein a signal input in said fourth electrode is amplified by said first and second amplifying means and is output from said fifth electrode.
Priority Claims (2)
Number |
Date |
Country |
Kind |
10-190809 |
Jul 1998 |
JP |
|
11-41045 |
Feb 1999 |
JP |
|
Parent Case Info
This application is a divisional application of U.S. Ser. No. 09/345,505, filed Jul. 1, 1999 now U.S. Pat. No. 6,330,165.
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