Claims
- 1. A method of fabricating a surface acoustic wave device, comprising the steps of:(a) disposing a first surface of a surface acoustic wave element facing an opposed portion of a first surface of a printed circuit board, the first surface of the surface acoustic wave element including at least a transducer portion; (b) disposing a member comprising hot melt material so that peripheral portions of said member extend beyond an outer perimeter of said surface acoustic wave element over a portion of the first surface of the printed circuit board distinct from and surrounding said outer perimeter of said surface acoustic wave element; and (c) sealing a space portion formed between said opposed portion and the first surface of the surface acoustic wave element by heating and deforming at least said peripheral portions of said member so as to form a sealing contact with at least part of the portion of the first surface of the printed circuit board distinct from and surrounding said opposed portion without the member spreading into the space portion, further comprising the step of disposing a frame-shaped member on the first surface of the printed circuit board in such a way that the frame-shaped member surrounds the space portion prior to performing step (a).
- 2. The method as set forth in claim 1 wherein the member is a member comprising an epoxy resin.
- 3. The method as set forth in claim 1, wherein the member is a member comprising a phenol based epoxy resin.
- 4. The method as set forth in claim 1, wherein the member is a member comprising a low-melting glass possessing a melting temperature in the range of from 320° C. to 350° C.
- 5. A method of fabricating a surface acoustic wave device, comprising the steps of:(a) disposing a first surface of a surface acoustic wave element facing an opposed portion of a first surface of a printed circuit board, the first surface of the surface acoustic wave element including at least a transducer portion; (b) disposing a member comprising hot melt material so that peripheral portions of said member extend beyond an outer perimeter of said surface acoustic wave element over a portion of the first surface of the printed circuit board distinct from and surrounding said outer perimeter of said surface acoustic wave element; and (c) sealing a space portion formed between said opposed portion and the first surface of the surface acoustic wave element by heating and deforming at least said peripheral portions of said member so as to form a sealing contact with at least part of the portion of the first surface of the printed circuit board distinct from and surrounding said opposed portion without the member spreading into the space portion, further comprising the initial step of providing the first surface of the surface acoustic wave element with bumps and then disposing the bumps on the first surface of the surface acoustic wave element above said opposed portion as part of step (a) along with an intermediate step of irradiating said bumps and/or said opposed portion to connect said surface acoustic wave element to said printed circuit board by said bumps prior to performing step (b).
- 6. A method of fabricating a surface acoustic wave device, comprising the steps of:(a) disposing a first surface of a surface acoustic wave element facing an opposed portion of a first surface of a printed circuit board, the first surface of the surface acoustic wave element including at least a transducer portion; (b) disposing a member comprising hot melt material so that peripheral portions of said member extend beyond an outer perimeter of said surface acoustic wave element over a portion of the first surface of the printed circuit board distinct from and surrounding said outer perimeter of said surface acoustic wave element; and (c) sealing a space portion formed between said opposed portion and the first surface of the surface acoustic wave element by heating and deforming at least said peripheral portions of said member so as to form a sealing contact with at least part of the portion of the first surface of the printed circuit board distinct from and surrounding said opposed portion without the member spreading into the space portion, wherein the member is a member comprising a phenol based epoxy resin.
- 7. A method of fabricating a surface acoustic wave device, comprising the steps of:(a) disposing a first surface of a surface acoustic wave element facing an opposed portion of a first surface of a printed circuit board, the first surface of the surface acoustic wave element including at least a transducer portion; (b) disposing a member comprising hot melt material so that peripheral portions of said member extend beyond an outer perimeter of said surface acoustic wave element over a portion of the first surface of the printed circuit board distinct from and surrounding said outer perimeter of said surface acoustic wave element; and (c) sealing a space portion formed between said opposed portion and the first surface of the surface acoustic wave element by heating and deforming at least said peripheral portions of said member so as to form a sealing contact with at least part of the portion of the first surface of the printed circuit board distinct from and surrounding said opposed portion without the member spreading into the space portion, wherein said peripheral portions have a flap shape prior to step (c).
Priority Claims (1)
Number |
Date |
Country |
Kind |
P7-164379 |
Jun 1995 |
JP |
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Parent Case Info
This is a division of appln. Ser. No. 08/973,858 filed Dec. 30, 1997 now U.S. Pat. No. 6,262,513
US Referenced Citations (15)
Foreign Referenced Citations (33)
Number |
Date |
Country |
52-16147 |
Feb 1977 |
JP |
53-129299 |
Nov 1978 |
JP |
54-11696 |
Jan 1979 |
JP |
55-61125 |
May 1980 |
JP |
56-92011 |
Jul 1981 |
JP |
57-173345 |
Nov 1982 |
JP |
59-63736 |
Apr 1984 |
JP |
62-98340 |
Jun 1987 |
JP |
62-205635 |
Sep 1987 |
JP |
1-25428 |
Jan 1989 |
JP |
1-84752 |
Mar 1989 |
JP |
01128438 |
May 1989 |
JP |
401133328 |
May 1989 |
JP |
0179018 |
Jul 1990 |
JP |
03-289208 |
Dec 1991 |
JP |
4-56510 |
Feb 1992 |
JP |
04-170811 |
Jun 1992 |
JP |
4-217335 |
Aug 1992 |
JP |
5-7121 |
Jan 1993 |
JP |
5-55303 |
Mar 1993 |
JP |
5-90885 |
Apr 1993 |
JP |
5-206523 |
Aug 1993 |
JP |
5-218230 |
Aug 1993 |
JP |
5-235203 |
Sep 1993 |
JP |
5-235688 |
Sep 1993 |
JP |
5-291864 |
Nov 1993 |
JP |
5-315397 |
Nov 1993 |
JP |
6-151626 |
May 1994 |
JP |
6-204293 |
Jul 1994 |
JP |
6-295937 |
Oct 1994 |
JP |
7-58149 |
Mar 1995 |
JP |
8-316778 |
Nov 1996 |
JP |
WO 9202040 |
Feb 1992 |
WO |
Non-Patent Literature Citations (1)
Entry |
Kagaku Daijiten (Chemical Dictionary), Maruzen K.K., p. 1189, Mar. 5, 1985. |