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Forming micro-structural systems
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B81C2203/00
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Parent Industries
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PERFORMING OPERATIONS TRANSPORTING
B81
Micro-structural technology
B81C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
Current Industry
B81C2203/00
Forming micro-structural systems
Sub Industries
B81C2203/01
Packaging MEMS
B81C2203/0109
Bonding an individual cap on the substrate
B81C2203/0118
Bonding a wafer on the substrate
B81C2203/0127
Using a carrier for applying a plurality of packaging lids to the system wafer
B81C2203/0136
Growing or depositing of a covering layer
B81C2203/0145
Hermetically sealing an opening in the lid
B81C2203/0154
Moulding a cap over the MEMS device
B81C2203/0163
Reinforcing a cap
B81C2203/0172
Seals
B81C2203/0181
Using micro-heaters for bonding the lid
B81C2203/019
characterised by the material or arrangement of seals between parts
B81C2203/03
Bonding two components
B81C2203/031
Anodic bondings
B81C2203/032
Gluing
B81C2203/033
Thermal bonding
B81C2203/035
Soldering
B81C2203/036
Fusion bonding
B81C2203/037
Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
B81C2203/038
Bonding techniques not provided for in B81C2203/031 - B81C2203/037
B81C2203/05
Aligning components to be assembled
B81C2203/051
Active alignment
B81C2203/052
Passive alignment
B81C2203/054
using structural alignment aids
B81C2203/055
using the surface tension of fluid solder to align the elements
B81C2203/057
Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055
B81C2203/058
Aligning components using methods not provided for in B81C2203/051 - B81C2203/052
B81C2203/07
Integrating an electronic processing unit with a micromechanical structure
B81C2203/0707
Monolithic integration
B81C2203/0714
Forming the micromechanical structure with a CMOS process
B81C2203/0721
Forming the micromechanical structure with a low-temperature process
B81C2203/0728
Pre-CMOS
B81C2203/0735
Post-CMOS
B81C2203/0742
Interleave
B81C2203/075
the electronic processing unit being integrated into an element of the micromechanical structure
B81C2203/0757
Topology for facilitating the monolithic integration
B81C2203/0764
Forming the micromechanical structure in a groove
B81C2203/0771
Stacking the electronic processing unit and the micromechanical structure
B81C2203/0778
Topology for facilitating the monolithic integration not provided for in B81C2203/0764 - B81C2203/0771
B81C2203/0785
Transfer and j oin technology
B81C2203/0792
Forming interconnections between the electronic processing unit and the micromechanical structure
Industries
Overview
Organizations
People
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Impact
Patents Grants
last 30 patents
Information
Patent Grant
Enclosed cavity structures
Patent number
11,981,559
Issue date
May 14, 2024
X-CELEPRINT LIMITED
Ronald S. Cok
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hermetically sealed transparent cavity and package for same
Patent number
11,975,962
Issue date
May 7, 2024
Schott AG
Jens Ulrich Thomas
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
11,973,048
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
An-Nong Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing a microelectromechanical sensor and microelect...
Patent number
11,958,740
Issue date
Apr 16, 2024
Robert Bosch GmbH
Achim Kronenberger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hollow package and method for manufacturing same
Patent number
11,955,394
Issue date
Apr 9, 2024
Nippon Kayaku Kabushiki Kaisha
Tadashi Naito
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microfluidic device
Patent number
11,944,965
Issue date
Apr 2, 2024
Imec VZW
Giuseppe Fiorentino
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated digital force sensors and related methods of manufacture
Patent number
11,946,817
Issue date
Apr 2, 2024
DecaWave, Ltd.
Ali Foughi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Systems and methods for providing getters in microelectromechanical...
Patent number
11,945,713
Issue date
Apr 2, 2024
Invensense, Inc.
Daesung Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic device and corresponding method
Patent number
11,945,714
Issue date
Apr 2, 2024
STMicroelectronics S.r.l.
Alex Gritti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device, manufacturing method of the same, and integrated MEMS...
Patent number
11,939,212
Issue date
Mar 26, 2024
Industrial Technology Research Institute
Heng-chung Chang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectromechanical structure including a functional element sit...
Patent number
11,939,215
Issue date
Mar 26, 2024
Robert Bosch GmbH
Penny Weir
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sound producing cell and manufacturing method thereof
Patent number
11,943,595
Issue date
Mar 26, 2024
xMEMS Labs, Inc.
Chiung C. Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
Patent number
11,932,534
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Hua Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Signal processing circuit for triple-membrane MEMS device
Patent number
11,932,533
Issue date
Mar 19, 2024
Infineon Technologies AG
Marc Fueldner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
Patent number
11,926,522
Issue date
Mar 12, 2024
Corporation for National Research Initiatives
Michael A. Huff
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microfabrication of omni-view peripheral scanning system
Patent number
11,926,523
Issue date
Mar 12, 2024
BEIJING VOYAGER TECHNOLOGY CO., LTD.
Youmin Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Methods including panel bonding acts and electronic devices includi...
Patent number
11,921,032
Issue date
Mar 5, 2024
Infineon Technologies AG
Horst Theuss
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor with dimple features and improved out-of-plane stiction
Patent number
11,919,769
Issue date
Mar 5, 2024
Invensense, Inc.
Ashfaque Uddin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,915,924
Issue date
Feb 27, 2024
Denso Corporation
Megumi Suzuki
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
Patent number
11,906,383
Issue date
Feb 20, 2024
Robert Bosch GmbH
Stefan Pinter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS tab removal process
Patent number
11,905,170
Issue date
Feb 20, 2024
Invensense, Inc.
Daesung Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Enclosed cavity structures
Patent number
11,897,760
Issue date
Feb 13, 2024
X-CELEPRINT LIMITED
Ronald S. Cok
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Capacitive microphone sensor design and fabrication method for achi...
Patent number
11,902,741
Issue date
Feb 13, 2024
Kathirgamasundaram Sooriakumar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method for forming the same
Patent number
11,897,759
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Po Chen Yeh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensing module and manufacturing method thereof
Patent number
11,894,473
Issue date
Feb 6, 2024
Ruei Chi Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
Patent number
11,891,298
Issue date
Feb 6, 2024
STMicroelectronics S.r.l.
Fabio Quaglia
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Enclosed cavity structures
Patent number
11,884,537
Issue date
Jan 30, 2024
X-CELEPRINT LIMITED
Ronald S. Cok
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Methods including panel bonding acts and electronic devices includi...
Patent number
11,885,736
Issue date
Jan 30, 2024
Infineon Technologies AG
Horst Theuss
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micro-electromechanical system device and method of forming the same
Patent number
11,878,905
Issue date
Jan 23, 2024
Vanguard International Semiconductor Corporation
Jia Jie Xia
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing damper structures on a micromechanical wafer
Patent number
11,873,216
Issue date
Jan 16, 2024
Robert Bosch GmbH
Michael Stumber
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...
Publication number
20240154599
Publication date
May 9, 2024
STMicroelectronics S.r.l.
Federico VERCESI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
Publication number
20240140782
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing company Ltd.
PO CHEN YEH
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
Publication number
20240140783
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Mark Andrew SHAW
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Publication number
20240132342
Publication date
Apr 25, 2024
ROBERT BOSCH GmbH
Bo CHENG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240132340
Publication date
Apr 25, 2024
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
Publication number
20240137711
Publication date
Apr 25, 2024
Innogrity Pte Ltd
KATHIRGAMASUNDARAM SOORIAKUMAR
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
Publication number
20240124299
Publication date
Apr 18, 2024
STMicroelectronics S.r.l.
Paolo FERRARI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240116752
Publication date
Apr 11, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
Publication number
20240116753
Publication date
Apr 11, 2024
Murata Manufacturing Co., Ltd.
Antti IIHOLA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE
Publication number
20240116749
Publication date
Apr 11, 2024
Vanguard International Semiconductor Corporation
Jia Jie Xia
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240116751
Publication date
Apr 11, 2024
XINTEC INC.
Chia-Ming CHENG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-...
Publication number
20240109771
Publication date
Apr 4, 2024
The University of British Columbia
Kenichi TAKAHATA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
Publication number
20240100565
Publication date
Mar 28, 2024
BFLY OPERATIONS, INC.
Jonathan M. Rothberg
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Support Device for One or More MEMS Components
Publication number
20240101412
Publication date
Mar 28, 2024
ROBERT BOSCH GmbH
Joachim Friedl
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20240092631
Publication date
Mar 21, 2024
Rohm Co., Ltd.
Yoshiyuki INUI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
Publication number
20240083742
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Li YANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
Publication number
20240087941
Publication date
Mar 14, 2024
Dow Toray Co., Ltd.
Nohno TODA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
Publication number
20240076181
Publication date
Mar 7, 2024
Samsung Electro-Mechanics Co., Ltd.
Seung Wook PARK
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
Publication number
20240051818
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hsi-Cheng HSU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE
Publication number
20240051819
Publication date
Feb 15, 2024
AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
Ping-He Chang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
Publication number
20240043265
Publication date
Feb 8, 2024
STMicroelectronics S.r.l.
Giorgio ALLEGATO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE MANUFACTURING
Publication number
20240043264
Publication date
Feb 8, 2024
Obsidian Sensors, Inc.
Tallis CHANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
Publication number
20240044846
Publication date
Feb 8, 2024
BFLY OPERATIONS, INC.
Jonathan M. Rothberg
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
Publication number
20240034618
Publication date
Feb 1, 2024
STMicroelectronics S.r.l.
Domenico GIUSTI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS
Publication number
20240036345
Publication date
Feb 1, 2024
Carl Zeiss SMT GMBH
Stefan SCHUETTER
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SOUND PRODUCING CELL
Publication number
20240031740
Publication date
Jan 25, 2024
xMEMS Labs, Inc.
Chiung C. Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
Publication number
20240024917
Publication date
Jan 25, 2024
BFLY OPERATIONS, INC.
Lingyun Miao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Anchor Structure
Publication number
20240017987
Publication date
Jan 18, 2024
SensorTek technology Corp.
Shih-Wei Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF
Publication number
20240022859
Publication date
Jan 18, 2024
xMEMS Labs, Inc.
Chiung C. Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
REDUCED LIGHT REFLECTION PACKAGE
Publication number
20240015447
Publication date
Jan 11, 2024
InvenSense, Inc.
Roberto Brioschi
B81 - MICRO-STRUCTURAL TECHNOLOGY