Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected H01L24/02Bonding areas ; Manufacturing methods related thereto H01L24/03Manufacturing methods H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process H01L24/05of an individual bonding area H01L24/06of a plurality of bonding areas H01L24/07Structure, shape, material or disposition of the bonding areas after the connecting process H01L24/08of an individual bonding area H01L24/09of a plurality of bonding areas H01L24/10Bump connectors ; Manufacturing methods related thereto H01L24/11Manufacturing methods H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process H01L24/13of an individual bump connector H01L24/14of a plurality of bump connectors H01L24/15Structure, shape, material or disposition of the bump connectors after the connecting process H01L24/16of an individual bump connector H01L24/17of a plurality of bump connectors H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto H01L24/19Manufacturing methods of high density interconnect preforms H01L24/20Structure, shape, material or disposition of high density interconnect preforms H01L24/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process H01L24/24of an individual high density interconnect connector H01L24/25of a plurality of high density interconnect connectors H01L24/26Layer connectors H01L24/27Manufacturing methods H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process H01L24/29of an individual layer connector H01L24/30of a plurality of layer connectors H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process H01L24/32of an individual layer connector H01L24/33of a plurality of layer connectors H01L24/34Strap connectors H01L24/35Manufacturing methods H01L24/36Structure, shape, material or disposition of the strap connectors prior to the connecting process H01L24/37of an individual strap connector H01L24/38of a plurality of strap connectors H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process H01L24/40of an individual strap connector H01L24/41of a plurality of strap connectors H01L24/42Wire connectors; Manufacturing methods related thereto H01L24/43Manufacturing methods H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process H01L24/45of an individual wire connector H01L24/46of a plurality of wire connectors H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process H01L24/48of an individual wire connector H01L24/49of a plurality of wire connectors H01L24/50Tape automated bonding [TAB] connectors H01L24/63Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto H01L24/64Manufacturing methods H01L24/65Structure, shape, material or disposition of the connectors prior to the connecting process H01L24/66of an individual connector H01L24/67of a plurality of connectors H01L24/68Structure, shape, material or disposition of the connectors after the connecting process H01L24/69of an individual connector H01L24/70of a plurality of connectors H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71 H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies H01L24/741Apparatus for manufacturing means for bonding H01L24/742Apparatus for manufacturing bump connectors H01L24/743Apparatus for manufacturing layer connectors H01L24/744Apparatus for manufacturing strap connectors H01L24/745Apparatus for manufacturing wire connectors H01L24/75Apparatus for connecting with bump connectors or layer connectors H01L24/76Apparatus for connecting with build-up interconnects H01L24/77Apparatus for connecting with strap connectors H01L24/78Apparatus for connecting with wire connectors H01L24/79Apparatus for Tape Automated Bonding [TAB] H01L24/799Apparatus for disconnecting H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected H01L24/81using a bump connector H01L24/82by forming build-up interconnects at chip-level H01L24/83using a layer connector H01L24/84using a strap connector H01L24/85using a wire connector H01L24/86using tape automated bonding [TAB] H01L24/89using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86 H01L24/90Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected H01L24/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90 H01L24/92Specific sequence of method steps H01L24/93Batch processes H01L24/94at wafer-level H01L24/95at chip-level H01L24/96the devices being encapsulated in a common layer H01L24/97the devices being connected to a common substrate H01L24/98Methods for disconnecting semiconductor or solid-state bodies