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B81C1/00
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PERFORMING OPERATIONS TRANSPORTING
B81
Micro-structural technology
B81C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
Current Industry
B81C1/00
Manufacture or treatment of devices or systems in or on a substrate
Sub Industries
B81C1/00007
Assembling automatically hinged components
B81C1/00015
for manufacturing micro-systems
B81C1/00023
without movable or flexible elements
B81C1/00031
Regular or irregular arrays of nanoscale structures
B81C1/00039
Anchors
B81C1/00047
Cavities
B81C1/00055
Grooves
B81C1/00063
Trenches
B81C1/00071
Channels
B81C1/00079
Grooves not provided for in groups B81C1/00063 - B81C1/00071
B81C1/00087
Holes
B81C1/00095
Interconnects
B81C1/00103
Structures having a predefined profile
B81C1/00111
Tips, pillars
B81C1/00119
Arrangement of basic structures like cavities or channels
B81C1/00126
Static structures not provided for in groups B81C1/00031 - B81C1/00119
B81C1/00134
comprising flexible or deformable structures
B81C1/00142
Bridges
B81C1/0015
Cantilevers
B81C1/00158
Diaphragms, membranes
B81C1/00166
Electrodes
B81C1/00174
See-saws
B81C1/00182
Arrangements of deformable or non-deformable structures
B81C1/0019
Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
B81C1/00198
comprising elements which are movable in relation to each other
B81C1/00206
Processes for functionalising a surface
B81C1/00214
Processes for the simultaneaous manufacturing of a network or an array of similar micro-structural devices
B81C1/00222
Integrating an electronic processing unit with a micromechanical structure
B81C1/0023
Packaging together an electronic processing unit die and a micromechanical structure die
B81C1/00238
Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
B81C1/00246
Monolithic integration
B81C1/00253
Processes for integrating an electronic processing unit with a micromechanical structure not provided for in B81C1/0023 - B81C1/00246
B81C1/00261
Processes for packaging MEMS devices
B81C1/00269
Bonding of solid lids or wafers to the substrate
B81C1/00277
for maintaining a controlled atmosphere inside of the cavity containing the MEMS
B81C1/00285
using materials for controlling the level of pressure, contaminants or moisture inside of the package
B81C1/00293
maintaining a controlled atmosphere with processes not provided for in B81C1/00285
B81C1/00301
Connecting electric signal lines from the MEMS device with external electrical signal lines
B81C1/00309
suitable for fluid transfer from the MEMS out of the package or vice-versa
B81C1/00317
Packaging optical devices
B81C1/00325
for reducing stress inside of the package structure
B81C1/00333
Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
B81C1/00341
Processes for manufacturing micro-systems not provided for in groups B81C1/00023 - B81C1/00261
B81C1/00349
Creating layers of material on a substrate
B81C1/00357
involving bonding one or several substrates on a non-temporary support
B81C1/00365
having low tensile stress between layers
B81C1/00373
Selective deposition
B81C1/0038
Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
B81C1/00388
Etch mask forming
B81C1/00396
Mask characterised by its composition
B81C1/00404
Mask characterised by its size, orientation or shape
B81C1/00412
Mask characterised by its behaviour during the etching process
B81C1/0042
Compensation masks in orientation dependent etching
B81C1/00428
Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042
B81C1/00436
Shaping materials
B81C1/00444
Surface micromachining
B81C1/0046
using stamping
B81C1/00468
Releasing structures
B81C1/00476
removing a sacrificial layer
B81C1/00484
Processes for releasing structures not provided for in group B81C1/00476
B81C1/00492
Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484
B81C1/005
Bulk micromachining
B81C1/00507
Formation of buried layers by techniques other than deposition
B81C1/00515
Bulk micromachining techniques not provided for in B81C1/00507
B81C1/00523
Etching material
B81C1/00531
Dry etching
B81C1/00539
Wet etching
B81C1/00547
Etching processes not provided for in groups B81C1/00531 - B81C1/00539
B81C1/00555
Achieving a desired geometry
B81C1/00563
Avoid or control over-etching
B81C1/00571
Avoid or control under-cutting
B81C1/00579
Avoid charge built-up
B81C1/00587
Processes for avoiding or controlling over-etching not provided for in B81C1/00571 - B81C1/00579
B81C1/00595
Control etch selectivity
B81C1/00603
Aligning features and geometries on both sides of a substrate
B81C1/00611
Processes for the planarisation of structures
B81C1/00619
Forming high aspect ratio structures having deep steep walls
B81C1/00626
Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
B81C1/00634
Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626
B81C1/00642
for improving the physical properties of a device
B81C1/0065
Mechanical properties
B81C1/00658
Treatments for improving the stiffness of a vibrating element
B81C1/00666
Treatments for controlling internal stress or strain in MEMS structures
B81C1/00674
Treatments for improving wear resistance
B81C1/00682
Treatments for improving mechanical properties, not provided for in B81C1/00658 - B81C1/0065
B81C1/0069
Thermal properties
B81C1/00698
Electrical characteristics
B81C1/00706
Magnetic properties
B81C1/00714
Treatment for improving the physical properties not provided for in groups B81C1/0065 - B81C1/00706
B81C1/00777
Preserve existing structures from alteration
B81C1/00785
Avoid chemical alteration
B81C1/00793
Avoid contamination
B81C1/00801
Avoid alteration of functional structures by etching
B81C1/00809
Methods to avoid chemical alteration not provided for in groups B81C1/00793 - B81C1/00801
B81C1/00817
Avoid thermal destruction
B81C1/00825
Protect against mechanical threats
B81C1/00833
Methods for preserving structures not provided for in groups B81C1/00785 - B81C1/00825
B81C1/00841
Cleaning during or after manufacture
B81C1/00849
during manufacture
B81C1/00857
after manufacture
B81C1/00865
Multistep processes for the separation of wafers into individual elements
B81C1/00873
characterised by special arrangements of the devices, allowing an easier separation
B81C1/0088
Separation allowing recovery of the substrate or a part of the substrate
B81C1/00888
Multistep processes involving only mechanical separation
B81C1/00896
Temporary protection during separation into individual elements
B81C1/00904
Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
B81C1/00912
Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
B81C1/0092
For avoiding stiction during the manufacturing process of the device
B81C1/00928
Eliminating or avoiding remaining moisture after the wet etch release of the movable structure
B81C1/00936
Releasing the movable structure without liquid etchant
B81C1/00944
Maintaining a critical distance between the structures to be released
B81C1/00952
Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944
B81C1/0096
For avoiding stiction when the device is in use
B81C1/00968
Methods for breaking the stiction bond
B81C1/00976
Control methods for avoiding stiction
B81C1/00984
Methods for avoiding stiction when the device is in use not provided for in groups B81C1/00968 - B81C1/00976
B81C1/00992
Treatments or methods for avoiding stiction of flexible or moving parts of MEMS not provided for in groups B81C1/0092 - B81C1/00984
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Sealed force sensor with etch stop layer
Patent number
11,965,787
Issue date
Apr 23, 2024
NEXTINPUT, INC.
Julius Minglin Tsai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device having uniform contacts
Patent number
11,964,866
Issue date
Apr 23, 2024
Qorvo US, Inc.
Mickael Renault
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bipolar transistor type MEMS pressure sensor and preparation method...
Patent number
11,965,797
Issue date
Apr 23, 2024
Wuxi Sencoch Semiconductor Co., Ltd.
Tongqing Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for ablating or roughening wafer surfaces
Patent number
11,958,739
Issue date
Apr 16, 2024
University of Rhode Island Board of Trustees
Jason Rodger Dwyer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing a microelectromechanical sensor and microelect...
Patent number
11,958,740
Issue date
Apr 16, 2024
Robert Bosch GmbH
Achim Kronenberger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectromechanical system (MEMS) structure and method of formation
Patent number
11,953,674
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Jose A. Martinez
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Modification to rough polysilicon using ion implantation and silicide
Patent number
11,952,267
Issue date
Apr 9, 2024
Invensense, Inc.
Alan Cuthbertson
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Engineered substrates, free-standing semiconductor microstructures,...
Patent number
11,952,268
Issue date
Apr 9, 2024
Lawrence Semiconductor Research Laboratory, Inc.
Chantal Arena
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Optical device production method
Patent number
11,953,675
Issue date
Apr 9, 2024
Hamamatsu Photonics K.K.
Tatsuya Sugimoto
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic device
Patent number
11,952,264
Issue date
Apr 9, 2024
Merry Electronics (Shenzhen) Co., Ltd.
Jia Yin Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hollow package and method for manufacturing same
Patent number
11,955,394
Issue date
Apr 9, 2024
Nippon Kayaku Kabushiki Kaisha
Tadashi Naito
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Packaging structure and method of MEMS pressure sensor
Patent number
11,953,392
Issue date
Apr 9, 2024
Wuxi Sencoch Semiconductor Co., Ltd.
Tongqing Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micro-device structures with etch holes
Patent number
11,952,266
Issue date
Apr 9, 2024
X-CELEPRINT LIMITED
Pierluigi Rubino
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microfluidic device
Patent number
11,944,965
Issue date
Apr 2, 2024
Imec VZW
Giuseppe Fiorentino
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated digital force sensors and related methods of manufacture
Patent number
11,946,817
Issue date
Apr 2, 2024
DecaWave, Ltd.
Ali Foughi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor transducer device with multilayer diaphragm and metho...
Patent number
11,946,822
Issue date
Apr 2, 2024
Sciosense B.V.
Alessandro Faes
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Capacitive micromachined ultrasonic transducer and method of fabric...
Patent number
11,944,998
Issue date
Apr 2, 2024
Korea Institute of Science and Technology
Byung Chul Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Process for manufacturing a micro-electro-mechanical device, and ME...
Patent number
11,945,712
Issue date
Apr 2, 2024
STMicroelectronics S.r.l.
Giorgio Allegato
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Systems and methods for providing getters in microelectromechanical...
Patent number
11,945,713
Issue date
Apr 2, 2024
Invensense, Inc.
Daesung Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic device and corresponding method
Patent number
11,945,714
Issue date
Apr 2, 2024
STMicroelectronics S.r.l.
Alex Gritti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Implantable microneedle and manufacturing method therefor
Patent number
11,938,308
Issue date
Mar 26, 2024
SNVIA CO., LTD.
Seung Yun Yang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device, manufacturing method of the same, and integrated MEMS...
Patent number
11,939,212
Issue date
Mar 26, 2024
Industrial Technology Research Institute
Heng-chung Chang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for manufacturing a device comprising a membrane extending o...
Patent number
11,939,214
Issue date
Mar 26, 2024
Soitec
Bruno Ghyselen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micromechanical component and method for producing a micromechanica...
Patent number
11,940,618
Issue date
Mar 26, 2024
Robert Bosch GmbH
Alexander Eberspaecher
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Programmable structural building blocks
Patent number
11,939,213
Issue date
Mar 26, 2024
Raytheon Company
Anthony Serino
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectromechanical structure including a functional element sit...
Patent number
11,939,215
Issue date
Mar 26, 2024
Robert Bosch GmbH
Penny Weir
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method with stealth dicing process for fabricating MEMS semiconduct...
Patent number
11,939,216
Issue date
Mar 26, 2024
Infineon Technologies AG
Andre Brockmeier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sound producing cell and manufacturing method thereof
Patent number
11,943,595
Issue date
Mar 26, 2024
xMEMS Labs, Inc.
Chiung C. Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
Patent number
11,932,534
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Hua Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device manufacturing method, MEMS device, and shutter apparatu...
Patent number
11,932,535
Issue date
Mar 19, 2024
Sumitomo Precision Products Co., LTD
Gen Matsuoka
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR ENCLOSING REFERENCE GASES IN MEMS CELLS
Publication number
20240133802
Publication date
Apr 25, 2024
HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
Achim BITTNER
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Publication number
20240132342
Publication date
Apr 25, 2024
ROBERT BOSCH GmbH
Bo CHENG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240132340
Publication date
Apr 25, 2024
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
Publication number
20240137711
Publication date
Apr 25, 2024
Innogrity Pte Ltd
KATHIRGAMASUNDARAM SOORIAKUMAR
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Devices and Methods of Manufacture
Publication number
20240124298
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yun-Chung Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
Publication number
20240124299
Publication date
Apr 18, 2024
STMicroelectronics S.r.l.
Paolo FERRARI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
Publication number
20240124300
Publication date
Apr 18, 2024
STMICROELECTRONICS, INC.
Jefferson Sismundo TALLEDO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FUSED QUARTZ DUAL SHELL RESONATOR AND METHOD OF FABRICATION
Publication number
20240125599
Publication date
Apr 18, 2024
The Regents of the University of California
Andrei M. SHKEL
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CARTRIDGE INTERFERENCE
Publication number
20240124297
Publication date
Apr 18, 2024
VueReal Inc.
Gholamreza CHAJI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR PROCESSING GLASS BY ALKALINE ETCHING
Publication number
20240116805
Publication date
Apr 11, 2024
SCHOTT AG
Andreas Ortner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROCHIPS FOR USE IN ELECTRON MICROSCOPES AND RELATED METHODS
Publication number
20240120172
Publication date
Apr 11, 2024
Northwestern University
Vinayak P. Dravid
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240116752
Publication date
Apr 11, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
Publication number
20240116753
Publication date
Apr 11, 2024
Murata Manufacturing Co., Ltd.
Antti IIHOLA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240116751
Publication date
Apr 11, 2024
XINTEC INC.
Chia-Ming CHENG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240109768
Publication date
Apr 4, 2024
Advanced Semiconductor Engineering, Inc.
Chieh-An YEH
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240109769
Publication date
Apr 4, 2024
XINTEC INC.
Wei-Luen SUEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Spring Supported and Sealed MEMS Diaphragm Assembly
Publication number
20240109770
Publication date
Apr 4, 2024
KNOWLES ELECTRONICS, LLC
Peter V. Loeppert
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-...
Publication number
20240109771
Publication date
Apr 4, 2024
The University of British Columbia
Kenichi TAKAHATA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
IMPLANTABLE MICRONEEDLE AND MANUFACTURING METHOD THEREFOR
Publication number
20240108817
Publication date
Apr 4, 2024
SNVIA CO., LTD.
Seung Yun YANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEMS MICROMIRRORS AND MICROMIRROR ARRAYS
Publication number
20240111148
Publication date
Apr 4, 2024
Preciseley Microtechnology Corp.
Tiansheng ZHOU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
NEURAL LATTICE DEVICE FOR CHARACTERIZATION OF NEURON BEHAVIOR
Publication number
20240101943
Publication date
Mar 28, 2024
International Business Machines Corporation
Sagarika Mukesh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Microfluidic Products with Controlled Fluid Flow
Publication number
20240100519
Publication date
Mar 28, 2024
Brian David BABCOCK
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TR...
Publication number
20240100566
Publication date
Mar 28, 2024
BFLY OPERATIONS, INC.
Lingyun Miao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Vibration-Driven Energy Harvesting Element and Method for Manufactu...
Publication number
20240106357
Publication date
Mar 28, 2024
Saginomiya Seisakusho, Inc.
Noriko Shimomura
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
Publication number
20240101413
Publication date
Mar 28, 2024
Intel Corporation
Jeremy D. Ecton
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
Publication number
20240100565
Publication date
Mar 28, 2024
BFLY OPERATIONS, INC.
Jonathan M. Rothberg
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Support Device for One or More MEMS Components
Publication number
20240101412
Publication date
Mar 28, 2024
ROBERT BOSCH GmbH
Joachim Friedl
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Reconfigurable Apparel Manufacture and Business Processes
Publication number
20240099425
Publication date
Mar 28, 2024
Nicole Justis Truitt
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240092632
Publication date
Mar 21, 2024
Rohm Co., Ltd.
Martin Wilfried HELLER
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-NANO CHANNEL STRUCTURE, SENSOR AND MANUFACTURING METHOD THERE...
Publication number
20240092628
Publication date
Mar 21, 2024
BOE TECHNOLOGY GROUP CO., LTD.
Xiaochen MA
B81 - MICRO-STRUCTURAL TECHNOLOGY