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B81C1/00
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PERFORMING OPERATIONS TRANSPORTING
B81
Micro-structural technology
B81C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
Current Industry
B81C1/00
Manufacture or treatment of devices or systems in or on a substrate
Sub Industries
B81C1/00007
Assembling automatically hinged components
B81C1/00015
for manufacturing micro-systems
B81C1/00023
without movable or flexible elements
B81C1/00031
Regular or irregular arrays of nanoscale structures
B81C1/00039
Anchors
B81C1/00047
Cavities
B81C1/00055
Grooves
B81C1/00063
Trenches
B81C1/00071
Channels
B81C1/00079
Grooves not provided for in groups B81C1/00063 - B81C1/00071
B81C1/00087
Holes
B81C1/00095
Interconnects
B81C1/00103
Structures having a predefined profile
B81C1/00111
Tips, pillars
B81C1/00119
Arrangement of basic structures like cavities or channels
B81C1/00126
Static structures not provided for in groups B81C1/00031 - B81C1/00119
B81C1/00134
comprising flexible or deformable structures
B81C1/00142
Bridges
B81C1/0015
Cantilevers
B81C1/00158
Diaphragms, membranes
B81C1/00166
Electrodes
B81C1/00174
See-saws
B81C1/00182
Arrangements of deformable or non-deformable structures
B81C1/0019
Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
B81C1/00198
comprising elements which are movable in relation to each other
B81C1/00206
Processes for functionalising a surface
B81C1/00214
Processes for the simultaneaous manufacturing of a network or an array of similar micro-structural devices
B81C1/00222
Integrating an electronic processing unit with a micromechanical structure
B81C1/0023
Packaging together an electronic processing unit die and a micromechanical structure die
B81C1/00238
Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
B81C1/00246
Monolithic integration
B81C1/00253
Processes for integrating an electronic processing unit with a micromechanical structure not provided for in B81C1/0023 - B81C1/00246
B81C1/00261
Processes for packaging MEMS devices
B81C1/00269
Bonding of solid lids or wafers to the substrate
B81C1/00277
for maintaining a controlled atmosphere inside of the cavity containing the MEMS
B81C1/00285
using materials for controlling the level of pressure, contaminants or moisture inside of the package
B81C1/00293
maintaining a controlled atmosphere with processes not provided for in B81C1/00285
B81C1/00301
Connecting electric signal lines from the MEMS device with external electrical signal lines
B81C1/00309
suitable for fluid transfer from the MEMS out of the package or vice-versa
B81C1/00317
Packaging optical devices
B81C1/00325
for reducing stress inside of the package structure
B81C1/00333
Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
B81C1/00341
Processes for manufacturing micro-systems not provided for in groups B81C1/00023 - B81C1/00261
B81C1/00349
Creating layers of material on a substrate
B81C1/00357
involving bonding one or several substrates on a non-temporary support
B81C1/00365
having low tensile stress between layers
B81C1/00373
Selective deposition
B81C1/0038
Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
B81C1/00388
Etch mask forming
B81C1/00396
Mask characterised by its composition
B81C1/00404
Mask characterised by its size, orientation or shape
B81C1/00412
Mask characterised by its behaviour during the etching process
B81C1/0042
Compensation masks in orientation dependent etching
B81C1/00428
Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042
B81C1/00436
Shaping materials
B81C1/00444
Surface micromachining
B81C1/0046
using stamping
B81C1/00468
Releasing structures
B81C1/00476
removing a sacrificial layer
B81C1/00484
Processes for releasing structures not provided for in group B81C1/00476
B81C1/00492
Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484
B81C1/005
Bulk micromachining
B81C1/00507
Formation of buried layers by techniques other than deposition
B81C1/00515
Bulk micromachining techniques not provided for in B81C1/00507
B81C1/00523
Etching material
B81C1/00531
Dry etching
B81C1/00539
Wet etching
B81C1/00547
Etching processes not provided for in groups B81C1/00531 - B81C1/00539
B81C1/00555
Achieving a desired geometry
B81C1/00563
Avoid or control over-etching
B81C1/00571
Avoid or control under-cutting
B81C1/00579
Avoid charge built-up
B81C1/00587
Processes for avoiding or controlling over-etching not provided for in B81C1/00571 - B81C1/00579
B81C1/00595
Control etch selectivity
B81C1/00603
Aligning features and geometries on both sides of a substrate
B81C1/00611
Processes for the planarisation of structures
B81C1/00619
Forming high aspect ratio structures having deep steep walls
B81C1/00626
Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
B81C1/00634
Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626
B81C1/00642
for improving the physical properties of a device
B81C1/0065
Mechanical properties
B81C1/00658
Treatments for improving the stiffness of a vibrating element
B81C1/00666
Treatments for controlling internal stress or strain in MEMS structures
B81C1/00674
Treatments for improving wear resistance
B81C1/00682
Treatments for improving mechanical properties, not provided for in B81C1/00658 - B81C1/0065
B81C1/0069
Thermal properties
B81C1/00698
Electrical characteristics
B81C1/00706
Magnetic properties
B81C1/00714
Treatment for improving the physical properties not provided for in groups B81C1/0065 - B81C1/00706
B81C1/00777
Preserve existing structures from alteration
B81C1/00785
Avoid chemical alteration
B81C1/00793
Avoid contamination
B81C1/00801
Avoid alteration of functional structures by etching
B81C1/00809
Methods to avoid chemical alteration not provided for in groups B81C1/00793 - B81C1/00801
B81C1/00817
Avoid thermal destruction
B81C1/00825
Protect against mechanical threats
B81C1/00833
Methods for preserving structures not provided for in groups B81C1/00785 - B81C1/00825
B81C1/00841
Cleaning during or after manufacture
B81C1/00849
during manufacture
B81C1/00857
after manufacture
B81C1/00865
Multistep processes for the separation of wafers into individual elements
B81C1/00873
characterised by special arrangements of the devices, allowing an easier separation
B81C1/0088
Separation allowing recovery of the substrate or a part of the substrate
B81C1/00888
Multistep processes involving only mechanical separation
B81C1/00896
Temporary protection during separation into individual elements
B81C1/00904
Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
B81C1/00912
Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
B81C1/0092
For avoiding stiction during the manufacturing process of the device
B81C1/00928
Eliminating or avoiding remaining moisture after the wet etch release of the movable structure
B81C1/00936
Releasing the movable structure without liquid etchant
B81C1/00944
Maintaining a critical distance between the structures to be released
B81C1/00952
Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944
B81C1/0096
For avoiding stiction when the device is in use
B81C1/00968
Methods for breaking the stiction bond
B81C1/00976
Control methods for avoiding stiction
B81C1/00984
Methods for avoiding stiction when the device is in use not provided for in groups B81C1/00968 - B81C1/00976
B81C1/00992
Treatments or methods for avoiding stiction of flexible or moving parts of MEMS not provided for in groups B81C1/0092 - B81C1/00984
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Systems and methods for fabricating microfluidic devices
Patent number
12,208,385
Issue date
Jan 28, 2025
The Charles Draper Laboratory, Inc.
Ashley Lynne Beckwith
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
Patent number
12,208,416
Issue date
Jan 28, 2025
Zhejiang Xiansheng Technology Co., Ltd.
Feng Yin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS packages and methods of manufacture thereof
Patent number
12,209,015
Issue date
Jan 28, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
Patent number
12,209,009
Issue date
Jan 28, 2025
Nanusens SL
Josep Montanyà Silvestre
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Arched membrane structure for MEMS device
Patent number
12,209,013
Issue date
Jan 28, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jhao-Yi Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for preparing a MEMS micro mirror with electrodes on both sides
Patent number
12,209,014
Issue date
Jan 28, 2025
Anhui China Science MW Electronic Technology Co., Ltd.
Wei Li
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor and method for reducing an interference signal component in...
Patent number
12,209,885
Issue date
Jan 28, 2025
Robert Bosch GmbH
Andrea Visconti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Wafer level package for device
Patent number
12,209,012
Issue date
Jan 28, 2025
Teknologian tutkimuskeskus VTT Oy
Jae-Wung Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Dry adhesives and methods for making dry adhesives
Patent number
12,203,015
Issue date
Jan 21, 2025
Carnegie Mellon University
Metin Sitti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Master mold for pattern transfer
Patent number
12,204,242
Issue date
Jan 21, 2025
University of Massachusetts
James J. Watkins
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
Patent number
12,202,724
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Ching-Kai Shen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated microfluidic system and method of fabrication
Patent number
12,194,464
Issue date
Jan 14, 2025
Corporation for National Research Initiatives
Michael A. Huff
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Piezoelectric micromachined ultrasonic transducer having a polymeri...
Patent number
12,195,327
Issue date
Jan 14, 2025
STMicroelectronics S.r.l.
Domenico Giusti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS devices with support structures and associated production methods
Patent number
12,195,325
Issue date
Jan 14, 2025
Infineon Technologies AG
Florian Brandl
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing a plurality of sensor devices, and sensor device
Patent number
12,195,330
Issue date
Jan 14, 2025
Robert Bosch GmbH
Daniel Haug
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Inkjet printing process
Patent number
12,194,751
Issue date
Jan 14, 2025
LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)
Nicolas Godard
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS cavity with non-contaminating seal
Patent number
12,187,606
Issue date
Jan 7, 2025
SiTime Corporation
Michael Julian Daneman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sound producing cell
Patent number
12,192,722
Issue date
Jan 7, 2025
xMEMS Labs, Inc.
Chiung C. Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic sensors with sensor die in package structure cavity
Patent number
12,187,601
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Barry Jon Male
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for manufacturing semiconductor substrate, method for manufa...
Patent number
12,187,607
Issue date
Jan 7, 2025
Hamamatsu Photonics K.K.
Nao Inoue
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Optical device production method
Patent number
12,189,114
Issue date
Jan 7, 2025
Hamamatsu Photonics K.K.
Tatsuya Sugimoto
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for etching gaps of unequal width
Patent number
12,187,605
Issue date
Jan 7, 2025
Murata Manufacturing Co., Ltd.
Petteri Kilpinen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor package and method of producing the sensor package
Patent number
12,180,066
Issue date
Dec 31, 2024
Sciosense B.V.
Willem Frederik Adrianus Besling
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Curved cantilever design to reduce stress in MEMS actuator
Patent number
12,180,064
Issue date
Dec 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Jung Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Self-folding 3D film assemblies
Patent number
12,180,068
Issue date
Dec 31, 2024
3M Innovative Properties Company
Jia Hu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectromechanical system and process of making it
Patent number
12,180,065
Issue date
Dec 31, 2024
AAC Acoustic Technologies (Shenzhen) Co., Ltd.
Euan James Boyd
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method and system for fabricating a MEMS device
Patent number
12,180,069
Issue date
Dec 31, 2024
Invensense, Inc.
Daesung Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Pizoelectric MEMS device with electrodes having low surface roughness
Patent number
12,185,631
Issue date
Dec 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Ren Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Methods and apparatuses for packaging an ultrasound-on-a-chip
Patent number
12,178,648
Issue date
Dec 31, 2024
BFLY OPERATIONS, INC.
Keith G. Fife
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sound producing package structure including sound producing membran...
Patent number
12,172,887
Issue date
Dec 24, 2024
xMEMS Labs, Inc.
Chiung C. Lo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR PROCESSING L...
Publication number
20250033956
Publication date
Jan 30, 2025
Canon Kabushiki Kaisha
Atsunori Terasaki
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FORMATION OF ANTIREFLECTIVE SURFACES
Publication number
20250033955
Publication date
Jan 30, 2025
Brookhaven Science Associates, LLC
Charles T. Black
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D Heterogeneously Integrated Power Electronic Building Blocks
Publication number
20250033954
Publication date
Jan 30, 2025
TELEDYNE SCIENTIFIC & IMAGING, LLC
Vivek Mehrotra
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS ACOUSTIC ELEMENT
Publication number
20250039611
Publication date
Jan 30, 2025
Murata Manufacturing Co., Ltd.
Ryosuke NIWA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ANCHOR STRUCTURE
Publication number
20250033951
Publication date
Jan 30, 2025
Bishnu Prasanna Gogoi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
APPARATUS FOR MASK-FREE MATERIAL DEPOSITION ON ARBITRARY SUBSTRATE...
Publication number
20250033141
Publication date
Jan 30, 2025
THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
Sen YANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
Publication number
20250026630
Publication date
Jan 23, 2025
AAC TECHNOLOGIES PTE. LTD
Veronica Tan
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS Array Structures for Gyroscopes with High Resonant Frequencies
Publication number
20250026629
Publication date
Jan 23, 2025
NXP USA, Inc.
Jun Tang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROELECTROMECHANICAL DEVICE, MICROELECTROMECHANICAL MICROPHONE AN...
Publication number
20250030987
Publication date
Jan 23, 2025
ROBERT BOSCH GmbH
Jochen Reinmuth
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS ELEMENT AND PIEZOELECTRIC ACOUSTIC DEVICE
Publication number
20250026631
Publication date
Jan 23, 2025
Murata Manufacturing Co., Ltd.
Hiroshi MATSUBARA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
Publication number
20250030998
Publication date
Jan 23, 2025
Vibrant Microsystems Inc.
Joseph Doll
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
Publication number
20250019224
Publication date
Jan 16, 2025
BOE TECHNOLOGY GROUP CO., LTD.
Jianxing LIU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE AND METHOD FOR PRODUCING MEMS DEVICE
Publication number
20250019226
Publication date
Jan 16, 2025
Rohm Co., Ltd.
Toma FUJITA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
APPARATUS AND METHODS FOR CONTROLLING INSERTION OF A MEMBRANE CHANN...
Publication number
20250018388
Publication date
Jan 16, 2025
Oxford Nanopore Technologies PLC
Daniel Ryan Garalde
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
STACKED-DIE MEMS RESONATOR
Publication number
20250019229
Publication date
Jan 16, 2025
SiTime Corporation
Pavan Gupta
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUB...
Publication number
20250019230
Publication date
Jan 16, 2025
Jagannathan Rajagopalan
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ADDITIVE MANUFACTURING USING BONDING OF VOXELS AND RELATED SYSTEMS,...
Publication number
20250011166
Publication date
Jan 9, 2025
Massachusetts Institute of Technology
Alain Stefan Reiser
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20250011165
Publication date
Jan 9, 2025
Vanguard International Semiconductor Corporation
JIA JIE XIA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME
Publication number
20250011157
Publication date
Jan 9, 2025
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Frank Senger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DEVICE FOR SENSING A MOTION OF A DEFLECTIVE SURFACE
Publication number
20250016509
Publication date
Jan 9, 2025
INFINEON TECHNOLOGIES AG
Darragh Francis Corrigan
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
COMMON MODE REJECTION STRUCTURES FOR MEMS DEVICES
Publication number
20250002331
Publication date
Jan 2, 2025
NXP USA, Inc.
Mostafa Soliman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MOLD UNIT FOR MANUFACTURING MICROSTRUCTURES
Publication number
20250001651
Publication date
Jan 2, 2025
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
Yong Hee KIM
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR CREATING SURFACE MICROSTRUCTURES
Publication number
20250004183
Publication date
Jan 2, 2025
ROLIC Technologies AG
Martin URBANSKI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
Publication number
20250002333
Publication date
Jan 2, 2025
STMicroelectronics International N.V.
Eric SAUGIER
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FORMING A PASSIVATION COATING FOR MEMS DEVICES
Publication number
20250002334
Publication date
Jan 2, 2025
TEXAS INSTRUMENTS INCORPORATED
Simon Joshua Jacobs
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS RESONATOR AND METHOD FOR PRODUCING THE SAME
Publication number
20240425360
Publication date
Dec 26, 2024
Rohm Co., Ltd.
Toma FUJITA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
LOW VOLTAGE CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) D...
Publication number
20240425365
Publication date
Dec 26, 2024
SENSONICS TRANSDUCERS PRIVATE LIMITED
Brishbhan Singh PANWAR
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...
Publication number
20240425366
Publication date
Dec 26, 2024
United Microelectronics Corp.
Jung-Hao CHANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE HAVING AN IMPROVED STRESS DISTRIBUTION AND MANUFACTURIN...
Publication number
20240425359
Publication date
Dec 26, 2024
STMicroelectronics S.r.l
Nicolo' BONI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
Publication number
20240425364
Publication date
Dec 26, 2024
NXP USA, Inc.
Chayathorn Saklang
B81 - MICRO-STRUCTURAL TECHNOLOGY