Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

H05K2203/01Tools for processing Objects used during processing H05K2203/0104for patterning or coating H05K2203/0108Male die used for patterning, punching or transferring H05K2203/0113Female die used for patterning or transferring H05K2203/0117Pattern shaped electrode used for patterning H05K2203/0121Patterning H05K2203/0126Dispenser H05K2203/013Inkjet printing H05K2203/0134Drum H05K2203/0139Blade or squeegee H05K2203/0143Using a roller Specific shape thereof Providing locally adhesive portions thereon H05K2203/0147Carriers and holders H05K2203/0152Temporary metallic carrier H05K2203/0156Temporary polymeric carrier or foil H05K2203/016Temporary inorganic, non-metallic carrier H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing H05K2203/0169Using a temporary frame during processing H05K2203/0173Template for holding a PCB having mounted components thereon H05K2203/0178Projectile H05K2203/0182Using a temporary spacer element or stand-off during processing H05K2203/0186Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof H05K2203/0191Using tape or non-metallic foil in a process H05K2203/0195Tool for a process not provided for in H05K3/00 H05K2203/02Details related to mechanical or acoustic processing H05K2203/0207Partly drilling through substrate until a controlled depth H05K2203/0214Back-up or entry material H05K2203/0221Perforating H05K2203/0228Cutting, sawing, milling or shearing H05K2203/0235Laminating followed by cutting or slicing perpendicular to plane of the laminate Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires H05K2203/0242Cutting around hole H05K2203/025Abrading H05K2203/0257Brushing H05K2203/0264Peeling insulating layer H05K2203/0271Mechanical force other than pressure H05K2203/0278Flat pressure H05K2203/0285Using ultrasound H05K2203/0292Using vibration H05K2203/03Metal processing H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface H05K2203/0315Oxidising metal H05K2203/0323Working metal substrate or core H05K2203/033Punching metal foil H05K2203/0338Transferring metal or conductive material other than a circuit pattern H05K2203/0346Deburring, rounding, bevelling or smoothing conductor edges H05K2203/0353Making conductive layer thin H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer H05K2203/0369Etching selective parts of a metal substrate through part of its thickness H05K2203/0376Etching temporary metallic carrier substrate H05K2203/0384Etch stop layer H05K2203/0392Pretreatment of metal H05K2203/04Soldering or other types of metallurgic bonding H05K2203/0405Solder foil, tape or wire H05K2203/041Solder preforms in the shape of solder balls H05K2203/0415Small preforms other than balls H05K2203/042Remote solder depot on the PCB, the solder flowing to the connections from this depot H05K2203/0425Solder powder or solder coated metal powder H05K2203/043Reflowing of solder coated conductors, not during connection of components H05K2203/0435Metal coated solder H05K2203/044Solder dip coating, i.e. coating printed conductors H05K2203/0445Removing excess solder on pads removing solder bridges H05K2203/045Solder filled PTH during processing H05K2203/0455PTH for surface mount device [SMD] H05K2203/046Means for drawing solder H05K2203/0465Shape of solder H05K2203/047Soldering with different solders H05K2203/0475Molten solder just before placing the component H05K2203/048Self-alignment during soldering Terminals, pads or shape of solder adapted therefor H05K2203/0485Tacky flux H05K2203/049Wire bonding H05K2203/0495Cold welding H05K2203/05Patterning and lithography Masks Details of resist H05K2203/0502Patterning and lithography H05K2203/0505Double exposure of the same photosensitive layer H05K2203/0508Flood exposure H05K2203/0511Diffusion patterning H05K2203/0514Photodevelopable thick film H05K2203/0517Electrographic patterning H05K2203/052Magnetographic patterning H05K2203/0522Using an adhesive pattern H05K2203/0525Patterning by phototackifying or by photopatterning adhesive H05K2203/0528Patterning during transfer, i.e. without preformed pattern H05K2203/0531Decalcomania H05K2203/0534Offset printing H05K2203/0537Transfer of pre-fabricated insulating pattern H05K2203/054Continuous temporary metal layer over resist H05K2203/0542Continuous temporary metal layer over metal pattern H05K2203/0545Pattern for applying drops or paste Applying a pattern made of drops or paste H05K2203/0548Masks H05K2203/0551Exposure mask directly printed on the PCB H05K2203/0554Metal used as mask for etching vias H05K2203/0557Non-printed masks H05K2203/056Using an artwork H05K2203/0562Details of resist H05K2203/0565Resist used only for applying catalyst, not for plating itself H05K2203/0568Resist used for applying paste, ink or powder H05K2203/0571Dual purpose resist H05K2203/0574Stacked resist layers used for different processes H05K2203/0577Double layer of resist having the same pattern H05K2203/058Additional resists used for the same purpose but in different areas H05K2203/0582Coating by resist H05K2203/0585Second resist used as mask for selective stripping of first resist H05K2203/0588Second resist used as pattern over first resist H05K2203/0591Organic non-polymeric coating H05K2203/0594Insulating resist or coating with special shaped edges H05K2203/0597Resist applied over the edges or sides of conductors H05K2203/06Lamination H05K2203/061of previously made multilayered subassemblies H05K2203/063of preperforated insulating layer H05K2203/065Binding insulating layers without adhesive H05K2203/066Transfer laminating of insulating material H05K2203/068Features of the lamination press or of the lamination process H05K2203/07Treatments involving liquids H05K2203/0703Plating H05K2203/0706Inactivating or removing catalyst H05K2203/0709Catalytic ink or adhesive for electroless plating H05K2203/0713Plating poison H05K2203/0716Metallic plating catalysts H05K2203/072Electroless plating H05K2203/0723Electroplating H05K2203/0726Electroforming H05K2203/073Displacement plating, substitution plating or immersion plating H05K2203/0733Method for plating stud vias H05K2203/0736Methods for applying liquids H05K2203/074Features related to the fluid pressure H05K2203/0743Mechanical agitation of fluid H05K2203/0746Local treatment using a fluid jet H05K2203/075Global treatment of printed circuits by fluid spraying H05K2203/0753Reversing fluid direction H05K2203/0756Uses of liquids H05K2203/0759Forming a polymer layer by liquid coating H05K2203/0763Treating individual holes or single row of holes H05K2203/0766Rinsing H05K2203/0769Dissolving insulating materials H05K2203/0773Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler H05K2203/0776Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773 H05K2203/0779characterised by the specific liquids involved H05K2203/0783Using solvent H05K2203/0786Using an aqueous solution H05K2203/0789Aqueous acid solution H05K2203/0793Aqueous alkaline solution H05K2203/0796Oxidant in aqueous solution H05K2203/08Treatments involving gases H05K2203/081Blowing of gas H05K2203/082Suction H05K2203/083Evaporation or sublimation of a compound H05K2203/085Using vacuum or low pressure H05K2203/086Using an inert gas H05K2203/087Using a reactive gas H05K2203/088Using a vapour or mist H05K2203/09Treatments involving charged particles H05K2203/092Particle beam H05K2203/095Plasma H05K2203/097Corona discharge H05K2203/10Using electric, magnetic and electromagnetic fields Using laser light H05K2203/101Using electrical induction H05K2203/102Using microwaves H05K2203/104Using magnetic force H05K2203/105Using an electrical field Special methods of applying an electric potential H05K2203/107Using laser light H05K2203/108Using a plurality of lasers or laser light with a plurality of wavelengths H05K2203/11Treatments characterised by their effect H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating H05K2203/111Preheating H05K2203/1115Resistance heating H05K2203/1121Cooling H05K2203/1126Firing H05K2203/1131Sintering H05K2203/1136Conversion of insulating material into conductive material H05K2203/1142Conversion of conductive material into insulating material or into dissolvable compound H05K2203/1147Sealing or impregnating H05K2203/1152Replicating the surface structure of a sacrificial layer H05K2203/1157Using means for chemical reduction H05K2203/1163Chemical reaction H05K2203/1168Graft-polymerization H05K2203/1173Differences in wettability H05K2203/1178Means for venting or for letting gases escape H05K2203/1184Underetching H05K2203/1189Pressing leads, bumps or a die through an insulating layer H05K2203/1194Thermal treatment leading to a different chemical state of a material H05K2203/12Using specific substances H05K2203/121Metallo-organic compounds H05K2203/122Organic non-polymeric compounds H05K2203/124Heterocyclic organic compounds H05K2203/125Inorganic compounds H05K2203/127Lubricants H05K2203/128Molten metals H05K2203/13Moulding and encapsulation Deposition techniques Protective layers H05K2203/1305Moulding and encapsulation H05K2203/1311Foil encapsulation H05K2203/1316Moulded encapsulation of mounted components H05K2203/1322Encapsulation comprising more than one layer H05K2203/1327Moulding over PCB locally or completely H05K2203/1333Deposition techniques H05K2203/1338Chemical vapour deposition H05K2203/1344Spraying small metal particles or droplets of molten metal H05K2203/135Electrophoretic deposition of insulating material H05K2203/1355Powder coating of insulating material H05K2203/1361Coating by immersion in coating bath H05K2203/1366Spraying coating H05K2203/1372Coating by using a liquid wave H05K2203/1377Protective layers H05K2203/1383Temporary protective insulating layer H05K2203/1388Temporary protective conductive layer H05K2203/1394Covering open PTHs H05K2203/14Related to the order of processing steps H05K2203/1407Applying catalyst before applying plating resist H05K2203/1415Applying catalyst after applying plating resist H05K2203/1423Applying catalyst before etching H05K2203/143Treating holes before another process H05K2203/1438Treating holes after another process H05K2203/1446Treatment after insertion of lead into hole H05K2203/1453Applying the circuit pattern before another process H05K2203/1461Applying or finishing the circuit pattern after another process H05K2203/1469Circuit made after mounting or encapsulation of the components H05K2203/1476Same or similar kind of process performed in phases H05K2203/1484Simultaneous treatments H05K2203/1492Periodical treatments H05K2203/15Position of the PCB during processing H05K2203/1509Horizontally held PCB H05K2203/1518Vertically held PCB H05K2203/1527Obliquely held PCB H05K2203/1536Temporarily stacked PCBs H05K2203/1545Continuous processing H05K2203/1554Rotating or turning the PCB in a continuous manner H05K2203/1563Reversing the PCB H05K2203/1572Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides H05K2203/1581Treating the backside of the PCB H05K2203/159Using gravitational force Processing against the gravity direction Using centrifugal force H05K2203/16Inspection Monitoring Aligning H05K2203/161Using chemical substances H05K2203/162Testing a finished product H05K2203/163Monitoring a manufacturing process H05K2203/165Stabilizing H05K2203/166Alignment or registration Control of registration H05K2203/167Using mechanical means for positioning, alignment or registration H05K2203/168Wrong mounting prevention H05K2203/17Post-manufacturing processes H05K2203/171Tuning H05K2203/173Adding connections between adjacent pads or conductors H05K2203/175Configurations of connections suitable for easy deletion H05K2203/176Removing, replacing or disconnecting component Easily removable component H05K2203/178Demolishing H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17 H05K2203/302Bending a rigid substrate Breaking rigid substrates by bending H05K2203/304Protecting a component during manufacturing H05K2203/306Lifting the component during or after mounting Increasing the gap between component and PCB H05K2203/308Sacrificial means