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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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H05K2203/00
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Parent Industries
H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Current Industry
H05K2203/00
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
Sub Industries
H05K2203/01
Tools for processing Objects used during processing
H05K2203/0104
for patterning or coating
H05K2203/0108
Male die used for patterning, punching or transferring
H05K2203/0113
Female die used for patterning or transferring
H05K2203/0117
Pattern shaped electrode used for patterning
H05K2203/0121
Patterning
H05K2203/0126
Dispenser
H05K2203/013
Inkjet printing
H05K2203/0134
Drum
H05K2203/0139
Blade or squeegee
H05K2203/0143
Using a roller Specific shape thereof Providing locally adhesive portions thereon
H05K2203/0147
Carriers and holders
H05K2203/0152
Temporary metallic carrier
H05K2203/0156
Temporary polymeric carrier or foil
H05K2203/016
Temporary inorganic, non-metallic carrier
H05K2203/0165
Holder for holding a Printed Circuit Board [PCB] during processing
H05K2203/0169
Using a temporary frame during processing
H05K2203/0173
Template for holding a PCB having mounted components thereon
H05K2203/0178
Projectile
H05K2203/0182
Using a temporary spacer element or stand-off during processing
H05K2203/0186
Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
H05K2203/0191
Using tape or non-metallic foil in a process
H05K2203/0195
Tool for a process not provided for in H05K3/00
H05K2203/02
Details related to mechanical or acoustic processing
H05K2203/0207
Partly drilling through substrate until a controlled depth
H05K2203/0214
Back-up or entry material
H05K2203/0221
Perforating
H05K2203/0228
Cutting, sawing, milling or shearing
H05K2203/0235
Laminating followed by cutting or slicing perpendicular to plane of the laminate Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
H05K2203/0242
Cutting around hole
H05K2203/025
Abrading
H05K2203/0257
Brushing
H05K2203/0264
Peeling insulating layer
H05K2203/0271
Mechanical force other than pressure
H05K2203/0278
Flat pressure
H05K2203/0285
Using ultrasound
H05K2203/0292
Using vibration
H05K2203/03
Metal processing
H05K2203/0307
Providing micro- or nanometer scale roughness on a metal surface
H05K2203/0315
Oxidising metal
H05K2203/0323
Working metal substrate or core
H05K2203/033
Punching metal foil
H05K2203/0338
Transferring metal or conductive material other than a circuit pattern
H05K2203/0346
Deburring, rounding, bevelling or smoothing conductor edges
H05K2203/0353
Making conductive layer thin
H05K2203/0361
Stripping a part of an upper metal layer to expose a lower metal layer
H05K2203/0369
Etching selective parts of a metal substrate through part of its thickness
H05K2203/0376
Etching temporary metallic carrier substrate
H05K2203/0384
Etch stop layer
H05K2203/0392
Pretreatment of metal
H05K2203/04
Soldering or other types of metallurgic bonding
H05K2203/0405
Solder foil, tape or wire
H05K2203/041
Solder preforms in the shape of solder balls
H05K2203/0415
Small preforms other than balls
H05K2203/042
Remote solder depot on the PCB, the solder flowing to the connections from this depot
H05K2203/0425
Solder powder or solder coated metal powder
H05K2203/043
Reflowing of solder coated conductors, not during connection of components
H05K2203/0435
Metal coated solder
H05K2203/044
Solder dip coating, i.e. coating printed conductors
H05K2203/0445
Removing excess solder on pads removing solder bridges
H05K2203/045
Solder filled PTH during processing
H05K2203/0455
PTH for surface mount device [SMD]
H05K2203/046
Means for drawing solder
H05K2203/0465
Shape of solder
H05K2203/047
Soldering with different solders
H05K2203/0475
Molten solder just before placing the component
H05K2203/048
Self-alignment during soldering Terminals, pads or shape of solder adapted therefor
H05K2203/0485
Tacky flux
H05K2203/049
Wire bonding
H05K2203/0495
Cold welding
H05K2203/05
Patterning and lithography Masks Details of resist
H05K2203/0502
Patterning and lithography
H05K2203/0505
Double exposure of the same photosensitive layer
H05K2203/0508
Flood exposure
H05K2203/0511
Diffusion patterning
H05K2203/0514
Photodevelopable thick film
H05K2203/0517
Electrographic patterning
H05K2203/052
Magnetographic patterning
H05K2203/0522
Using an adhesive pattern
H05K2203/0525
Patterning by phototackifying or by photopatterning adhesive
H05K2203/0528
Patterning during transfer, i.e. without preformed pattern
H05K2203/0531
Decalcomania
H05K2203/0534
Offset printing
H05K2203/0537
Transfer of pre-fabricated insulating pattern
H05K2203/054
Continuous temporary metal layer over resist
H05K2203/0542
Continuous temporary metal layer over metal pattern
H05K2203/0545
Pattern for applying drops or paste Applying a pattern made of drops or paste
H05K2203/0548
Masks
H05K2203/0551
Exposure mask directly printed on the PCB
H05K2203/0554
Metal used as mask for etching vias
H05K2203/0557
Non-printed masks
H05K2203/056
Using an artwork
H05K2203/0562
Details of resist
H05K2203/0565
Resist used only for applying catalyst, not for plating itself
H05K2203/0568
Resist used for applying paste, ink or powder
H05K2203/0571
Dual purpose resist
H05K2203/0574
Stacked resist layers used for different processes
H05K2203/0577
Double layer of resist having the same pattern
H05K2203/058
Additional resists used for the same purpose but in different areas
H05K2203/0582
Coating by resist
H05K2203/0585
Second resist used as mask for selective stripping of first resist
H05K2203/0588
Second resist used as pattern over first resist
H05K2203/0591
Organic non-polymeric coating
H05K2203/0594
Insulating resist or coating with special shaped edges
H05K2203/0597
Resist applied over the edges or sides of conductors
H05K2203/06
Lamination
H05K2203/061
of previously made multilayered subassemblies
H05K2203/063
of preperforated insulating layer
H05K2203/065
Binding insulating layers without adhesive
H05K2203/066
Transfer laminating of insulating material
H05K2203/068
Features of the lamination press or of the lamination process
H05K2203/07
Treatments involving liquids
H05K2203/0703
Plating
H05K2203/0706
Inactivating or removing catalyst
H05K2203/0709
Catalytic ink or adhesive for electroless plating
H05K2203/0713
Plating poison
H05K2203/0716
Metallic plating catalysts
H05K2203/072
Electroless plating
H05K2203/0723
Electroplating
H05K2203/0726
Electroforming
H05K2203/073
Displacement plating, substitution plating or immersion plating
H05K2203/0733
Method for plating stud vias
H05K2203/0736
Methods for applying liquids
H05K2203/074
Features related to the fluid pressure
H05K2203/0743
Mechanical agitation of fluid
H05K2203/0746
Local treatment using a fluid jet
H05K2203/075
Global treatment of printed circuits by fluid spraying
H05K2203/0753
Reversing fluid direction
H05K2203/0756
Uses of liquids
H05K2203/0759
Forming a polymer layer by liquid coating
H05K2203/0763
Treating individual holes or single row of holes
H05K2203/0766
Rinsing
H05K2203/0769
Dissolving insulating materials
H05K2203/0773
Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler
H05K2203/0776
Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
H05K2203/0779
characterised by the specific liquids involved
H05K2203/0783
Using solvent
H05K2203/0786
Using an aqueous solution
H05K2203/0789
Aqueous acid solution
H05K2203/0793
Aqueous alkaline solution
H05K2203/0796
Oxidant in aqueous solution
H05K2203/08
Treatments involving gases
H05K2203/081
Blowing of gas
H05K2203/082
Suction
H05K2203/083
Evaporation or sublimation of a compound
H05K2203/085
Using vacuum or low pressure
H05K2203/086
Using an inert gas
H05K2203/087
Using a reactive gas
H05K2203/088
Using a vapour or mist
H05K2203/09
Treatments involving charged particles
H05K2203/092
Particle beam
H05K2203/095
Plasma
H05K2203/097
Corona discharge
H05K2203/10
Using electric, magnetic and electromagnetic fields Using laser light
H05K2203/101
Using electrical induction
H05K2203/102
Using microwaves
H05K2203/104
Using magnetic force
H05K2203/105
Using an electrical field Special methods of applying an electric potential
H05K2203/107
Using laser light
H05K2203/108
Using a plurality of lasers or laser light with a plurality of wavelengths
H05K2203/11
Treatments characterised by their effect
H05K2203/1105
Heating or thermal processing not related to soldering, firing, curing or laminating
H05K2203/111
Preheating
H05K2203/1115
Resistance heating
H05K2203/1121
Cooling
H05K2203/1126
Firing
H05K2203/1131
Sintering
H05K2203/1136
Conversion of insulating material into conductive material
H05K2203/1142
Conversion of conductive material into insulating material or into dissolvable compound
H05K2203/1147
Sealing or impregnating
H05K2203/1152
Replicating the surface structure of a sacrificial layer
H05K2203/1157
Using means for chemical reduction
H05K2203/1163
Chemical reaction
H05K2203/1168
Graft-polymerization
H05K2203/1173
Differences in wettability
H05K2203/1178
Means for venting or for letting gases escape
H05K2203/1184
Underetching
H05K2203/1189
Pressing leads, bumps or a die through an insulating layer
H05K2203/1194
Thermal treatment leading to a different chemical state of a material
H05K2203/12
Using specific substances
H05K2203/121
Metallo-organic compounds
H05K2203/122
Organic non-polymeric compounds
H05K2203/124
Heterocyclic organic compounds
H05K2203/125
Inorganic compounds
H05K2203/127
Lubricants
H05K2203/128
Molten metals
H05K2203/13
Moulding and encapsulation Deposition techniques Protective layers
H05K2203/1305
Moulding and encapsulation
H05K2203/1311
Foil encapsulation
H05K2203/1316
Moulded encapsulation of mounted components
H05K2203/1322
Encapsulation comprising more than one layer
H05K2203/1327
Moulding over PCB locally or completely
H05K2203/1333
Deposition techniques
H05K2203/1338
Chemical vapour deposition
H05K2203/1344
Spraying small metal particles or droplets of molten metal
H05K2203/135
Electrophoretic deposition of insulating material
H05K2203/1355
Powder coating of insulating material
H05K2203/1361
Coating by immersion in coating bath
H05K2203/1366
Spraying coating
H05K2203/1372
Coating by using a liquid wave
H05K2203/1377
Protective layers
H05K2203/1383
Temporary protective insulating layer
H05K2203/1388
Temporary protective conductive layer
H05K2203/1394
Covering open PTHs
H05K2203/14
Related to the order of processing steps
H05K2203/1407
Applying catalyst before applying plating resist
H05K2203/1415
Applying catalyst after applying plating resist
H05K2203/1423
Applying catalyst before etching
H05K2203/143
Treating holes before another process
H05K2203/1438
Treating holes after another process
H05K2203/1446
Treatment after insertion of lead into hole
H05K2203/1453
Applying the circuit pattern before another process
H05K2203/1461
Applying or finishing the circuit pattern after another process
H05K2203/1469
Circuit made after mounting or encapsulation of the components
H05K2203/1476
Same or similar kind of process performed in phases
H05K2203/1484
Simultaneous treatments
H05K2203/1492
Periodical treatments
H05K2203/15
Position of the PCB during processing
H05K2203/1509
Horizontally held PCB
H05K2203/1518
Vertically held PCB
H05K2203/1527
Obliquely held PCB
H05K2203/1536
Temporarily stacked PCBs
H05K2203/1545
Continuous processing
H05K2203/1554
Rotating or turning the PCB in a continuous manner
H05K2203/1563
Reversing the PCB
H05K2203/1572
Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides
H05K2203/1581
Treating the backside of the PCB
H05K2203/159
Using gravitational force Processing against the gravity direction Using centrifugal force
H05K2203/16
Inspection Monitoring Aligning
H05K2203/161
Using chemical substances
H05K2203/162
Testing a finished product
H05K2203/163
Monitoring a manufacturing process
H05K2203/165
Stabilizing
H05K2203/166
Alignment or registration Control of registration
H05K2203/167
Using mechanical means for positioning, alignment or registration
H05K2203/168
Wrong mounting prevention
H05K2203/17
Post-manufacturing processes
H05K2203/171
Tuning
H05K2203/173
Adding connections between adjacent pads or conductors
H05K2203/175
Configurations of connections suitable for easy deletion
H05K2203/176
Removing, replacing or disconnecting component Easily removable component
H05K2203/178
Demolishing
H05K2203/30
Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
H05K2203/302
Bending a rigid substrate Breaking rigid substrates by bending
H05K2203/304
Protecting a component during manufacturing
H05K2203/306
Lifting the component during or after mounting Increasing the gap between component and PCB
H05K2203/308
Sacrificial means
Industries
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Patents Grants
last 30 patents
Information
Patent Grant
Printer for applying a conductive pattern to a surface
Patent number
11,969,992
Issue date
Apr 30, 2024
HEMPEL A/S
Josep Palasi Bargallo
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Method for manufacturing an electronic device
Patent number
11,974,403
Issue date
Apr 30, 2024
Innolux Corporation
Yu-Chia Huang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Array substrate and method of mounting integrated circuit using the...
Patent number
11,967,597
Issue date
Apr 23, 2024
Samsung Display Co., Ltd.
Dae Geun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board structure including a closed cavity
Patent number
11,967,758
Issue date
Apr 23, 2024
Skyworks Solutions, Inc.
Ki Wook Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting device and control method for same
Patent number
11,968,785
Issue date
Apr 23, 2024
FUJI CORPORATION
Hidetoshi Kawai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for increasing adhesion strength between a surface of copper...
Patent number
11,963,308
Issue date
Apr 16, 2024
Atotech Deutschland GmbH & Co. KG
Norbert Lützow
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Machining station and method for machining workpieces
Patent number
11,963,305
Issue date
Apr 16, 2024
Skybrain Vermögensverwaltungs GmbH
Markus Winterschladen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Vacuum-assisted BGA joint formation
Patent number
11,963,307
Issue date
Apr 16, 2024
International Business Machines Corporation
Matthew Doyle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
Patent number
11,963,294
Issue date
Apr 16, 2024
Murata Manufacturing Co., Ltd.
Tomohiro Furumura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for manufacturing printed circuit boards
Patent number
11,963,306
Issue date
Apr 16, 2024
Gebr. Schmid GmbH
Christian Schmid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate for high-frequency printed wiring board
Patent number
RE49929
Issue date
Apr 16, 2024
Sumitomo Electric Industries, Ltd.
Shingo Kaimori
Information
Patent Grant
Process for laminating conductive-lubricant coated metals for print...
Patent number
11,963,309
Issue date
Apr 16, 2024
Mellanox Technologies, Ltd.
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional (3D) copper in printed circuit boards
Patent number
11,956,898
Issue date
Apr 9, 2024
Apple Inc.
Anne M. Mason
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package device and method of manufacturing the same
Patent number
11,956,897
Issue date
Apr 9, 2024
Advanced Semiconductor Engineering, Inc.
Ming-Ze Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder recovery device
Patent number
11,956,902
Issue date
Apr 9, 2024
FUJI CORPORATION
Naoki Matsuzaki
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Multilayer circuit board and manufacturing method therefor
Patent number
11,956,904
Issue date
Apr 9, 2024
STEMCO CO., LTD.
Jae Soo Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
Patent number
11,950,360
Issue date
Apr 2, 2024
Murata Manufacturing Co., Ltd.
Koki Sai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laminate
Patent number
11,946,143
Issue date
Apr 2, 2024
Arisawa Mfg. Co., Ltd.
Kenji Nakamura
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Flexible printed circuit board and method of manufacturing same
Patent number
11,950,365
Issue date
Apr 2, 2024
Sumitomo Electric Industries, Ltd.
Shoichiro Sakai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing transparent circuit board
Patent number
11,950,371
Issue date
Apr 2, 2024
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
Cheng-Jia Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Feature selection through solder-ball population
Patent number
11,948,807
Issue date
Apr 2, 2024
International Business Machines Corporation
Matthew Doyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via bond attachment
Patent number
11,950,378
Issue date
Apr 2, 2024
Sergio Ramirez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming hermetically-sealed packages including feedthro...
Patent number
11,950,387
Issue date
Apr 2, 2024
Medtronic, Inc.
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A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Methods of making metal patterns on flexible substrate
Patent number
11,950,372
Issue date
Apr 2, 2024
3M INNOVATION PROPERTIES
Henrik B. van Lengerich
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
Patent number
11,950,373
Issue date
Apr 2, 2024
Lockheed Martin Corporation
Marc T. Angelucci
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automatically controlling a liquid spray pattern
Patent number
11,938,498
Issue date
Mar 26, 2024
Precision Valve & Automation, Inc.
Jason Schoen
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Stacking arrays and separator bodies during processing of component...
Patent number
11,943,874
Issue date
Mar 26, 2024
AT&S (Chongqing) Company Limited
Amin Nickkolgh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Shielded hearing device components and related methods
Patent number
11,943,589
Issue date
Mar 26, 2024
GN HEARING A/S
Thorvaldur Oli Bodvarsson
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Display device manufacturing apparatus with rotator and display dev...
Patent number
11,937,490
Issue date
Mar 19, 2024
Samsung Display Co., Ltd.
Myung Gil Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Forming electrical interconnections using capillary microfluidics
Patent number
11,937,381
Issue date
Mar 19, 2024
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Flexible printed circuit, ink and method for obtaining flexible pri...
Publication number
20240147618
Publication date
May 2, 2024
UNIVERSIDADE DE COIMBRA
Mahmoud TAVAKOLI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
Publication number
20240147629
Publication date
May 2, 2024
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
CHANG-HE ZHU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
Publication number
20240147627
Publication date
May 2, 2024
Panasonic Intellectual Property Management Co., Ltd.
Tomohiro FUKAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20240147634
Publication date
May 2, 2024
Samsung Electro-Mechanics Co., Ltd.
In Gun KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
AUTOMATED PRESSURE CONTROL SYSTEM AND METHOD FOR A CLEANER
Publication number
20240139764
Publication date
May 2, 2024
Illinois Tool Works Inc.
Eric Wayne Becker
B08 - CLEANING
Information
Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
Publication number
20240147631
Publication date
May 2, 2024
Liquid Wire, LLC
Jorge E. Carbo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD
Publication number
20240147632
Publication date
May 2, 2024
YAZAKI CORPORATION
Mitsuaki Maeda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
Publication number
20240147619
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jongwan SHIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
Publication number
20240147624
Publication date
May 2, 2024
Canon Kabushiki Kaisha
NORITAKE TSUBOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Publication number
20240147630
Publication date
May 2, 2024
FUJIFILM CORPORATION
Kazuo KAMOHARA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
Publication number
20240147633
Publication date
May 2, 2024
DAIWA CO., LTD.
Eiji YOSHIMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES
Publication number
20240138061
Publication date
Apr 25, 2024
Saudi Arabian Oil Company
Sahil P. Wankhede
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...
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20240134277
Publication date
Apr 25, 2024
Resonac Corporation
Yuta DAIJIMA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
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20240138076
Publication date
Apr 25, 2024
IBIDEN CO., LTD.
Ikuya TERAUCHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
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20240138063
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Apr 25, 2024
Unimicron Technology Corp.
Ping-Tsung Lin
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Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
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20240132441
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Apr 25, 2024
YMT CO., LTD.
Sung Wook CHUN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
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20240138059
Publication date
Apr 25, 2024
Unimicron Technology Corp.
Kai-Ming Yang
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MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
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20240131339
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Apr 25, 2024
The Regents of the University of California
Shadi A. Dayeh
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
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LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
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20240130045
Publication date
Apr 18, 2024
Medimaging Integrated Solution, Inc.
SHANGYI WU
G02 - OPTICS
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SENSORS, SYSTEMS AND METHODS FOR DETECTING ANALYTES USING SAME
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20240125738
Publication date
Apr 18, 2024
MODOC TECHNOLOGIES, LLC
David H. Sierra
G01 - MEASURING TESTING
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ELECTRONIC APPARATUS
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20240130035
Publication date
Apr 18, 2024
FUJIFILM CORPORATION
Yota AKASHI
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Patent Application
BENDING APPARATUS AND BENDING METHOD USING THE SAME
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20240130049
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
DONGWOO KIM
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Patent Application
CHEMICAL LIBERATION OF WASTE PRINTED CIRCUIT BOARDS
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20240123480
Publication date
Apr 18, 2024
INTEGRATED RECYCLING TECHNOLOGIES CORPORATION
Benjamin Turner Suslavich
B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
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Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
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20240128093
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Apr 18, 2024
ASUSTek COMPUTER INC.
Xu Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Sulfide Solid-State Battery, Printed Circuit Board with Sulfide Sol...
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20240120552
Publication date
Apr 11, 2024
Toyota Jidosha Kabushiki Kaisha
Shinji NAKANISHI
H01 - BASIC ELECTRIC ELEMENTS
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SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
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20240121888
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Apr 11, 2024
Vayyar Imaging Ltd.
Rohi HALIMI
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Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
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20240121899
Publication date
Apr 11, 2024
InnoLux Corporation
Chin-Cheng Kuo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
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20240120243
Publication date
Apr 11, 2024
LG Innotek Co., Ltd.
Jong Bae SHIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
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20240121897
Publication date
Apr 11, 2024
NXP B.V.
Abdellatif Zanati
H01 - BASIC ELECTRIC ELEMENTS