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INTERCONNECT STRIPS
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Publication number 20240128094
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Publication date Apr 18, 2024
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TEXAS INSTRUMENTS INCORPORATED
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CHIH-CHIEN HO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240128122
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Publication date Apr 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Wei-Chung Chang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240128135
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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GYOSOO CHOO
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H01 - BASIC ELECTRIC ELEMENTS
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O-RING SEALS FOR FLUID SENSING
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Publication number 20240128137
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Publication date Apr 18, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Sebastian Meier
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H01 - BASIC ELECTRIC ELEMENTS
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SENSOR PACKAGE STRUCTURE
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Publication number 20240128139
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Publication date Apr 18, 2024
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TONG HSING ELECTRONIC INDUSTRIES, LTD.
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WEI-LI WANG
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H01 - BASIC ELECTRIC ELEMENTS
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-
-
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SEMICONDUCTOR DEVICE
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Publication number 20240128169
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Publication date Apr 18, 2024
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ROHM CO., LTD.
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Hajime OKUDA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240128174
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Choongbin Yim
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H01 - BASIC ELECTRIC ELEMENTS
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-
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COOLING DEVICE
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Publication number 20240125561
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Publication date Apr 18, 2024
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Fujitsu Limited
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KENTO OHGA
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F28 - HEAT EXCHANGE IN GENERAL
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-
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SUBSTRATE PROCESSING AND PACKAGING
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Publication number 20240128199
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Publication date Apr 18, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Jane Qian Liu
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP SIZE PACKAGE AND SYSTEM
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Publication number 20240128203
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Publication date Apr 18, 2024
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STMicroelectronics Pte Ltd
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Jing-En LUAN
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H01 - BASIC ELECTRIC ELEMENTS
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-
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SEMICONDUCTOR PACKAGE
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Publication number 20240128234
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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JUNGPIL LEE
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H01 - BASIC ELECTRIC ELEMENTS
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