Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/0001Technical content checked by a classifier H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group H01L2924/00012Relevant to the scope of the group, the symbol of which is combined with the symbol of this group H01L2924/00013Fully indexed content H01L2924/00014the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details H01L2924/00015the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00 H01L2924/01Chemical elements H01L2924/01001Hydrogen [H] H01L2924/01002Helium [He] H01L2924/01003Lithium [Li] H01L2924/01004Beryllium [Be] H01L2924/01005Boron [B] H01L2924/01006Carbon [C] H01L2924/01007Nitrogen [N] H01L2924/01008Oxygen [O] H01L2924/01009Fluorine [F] H01L2924/0101Neon [Ne] H01L2924/01011Sodium [Na] H01L2924/01012Magnesium [Mg] H01L2924/01013Aluminum [Al] H01L2924/01014Silicon [Si] H01L2924/01015Phosphorus [P] H01L2924/01016Sulfur [S] H01L2924/01017Chlorine [Cl] H01L2924/01018Argon [Ar] H01L2924/01019Potassium [K] H01L2924/0102Calcium [Ca] H01L2924/01021Scandium [Sc] H01L2924/01022Titanium [Ti] H01L2924/01023Vanadium [V] H01L2924/01024Chromium [Cr] H01L2924/01025Manganese [Mn] H01L2924/01026Iron [Fe] H01L2924/01027Cobalt [Co] H01L2924/01028Nickel [Ni] H01L2924/01029Copper [Cu] H01L2924/0103Zinc [Zn] H01L2924/01031Gallium [Ga] H01L2924/01032Germanium [Ge] H01L2924/01033Arsenic [As] H01L2924/01034Selenium [Se] H01L2924/01035Bromine [Br] H01L2924/01036Krypton [Kr] H01L2924/01037Rubidium [Rb] H01L2924/01038Strontium [Sr] H01L2924/01039Yttrium [Y] H01L2924/0104Zirconium [Zr] H01L2924/01041Niobium [Nb] H01L2924/01042Molybdenum [Mo] H01L2924/01043Technetium [Tc] H01L2924/01044Ruthenium [Ru] H01L2924/01045Rhodium [Rh] H01L2924/01046Palladium [Pd] H01L2924/01047Silver [Ag] H01L2924/01048Cadmium [Cd] H01L2924/01049Indium [In] H01L2924/0105Tin [Sn] H01L2924/01051Antimony [Sb] H01L2924/01052Tellurium [Te] H01L2924/01053Iodine [I] H01L2924/01054Xenon [Xe] H01L2924/01055Cesium [Cs] H01L2924/01056Barium [Ba] H01L2924/01057Lanthanum [La] H01L2924/01058Cerium [Ce] H01L2924/01059Praseodymium [Pr] H01L2924/0106Neodymium [Nd] H01L2924/01061Promethium [Pm] H01L2924/01062Samarium [Sm] H01L2924/01063Europium [Eu] H01L2924/01064Gadolinium [Gd] H01L2924/01065Terbium [Tb] H01L2924/01066Dysprosium [Dy] H01L2924/01067Holmium [Ho] H01L2924/01068Erbium [Er] H01L2924/01069Thulium [Tm] H01L2924/0107Ytterbium [Yb] H01L2924/01071Lutetium [Lu] H01L2924/01072Hafnium [Hf] H01L2924/01073Tantalum [Ta] H01L2924/01074Tungsten [W] H01L2924/01075Rhenium [Re] H01L2924/01076Osmium [Os] H01L2924/01077Iridium [Ir] H01L2924/01078Platinum [Pt] H01L2924/01079Gold [Au] H01L2924/0108Mercury [Hg] H01L2924/01081Thallium [Tl] H01L2924/01082Lead [Pb] H01L2924/01083Bismuth [Bi] H01L2924/01084Polonium [Po] H01L2924/01085Astatine [At] H01L2924/01086Radon [Rn] H01L2924/01087Francium [Fr] H01L2924/01088Radium [Ra] H01L2924/01089Actinium [Ac] H01L2924/0109Thorium [Th] H01L2924/01091Protactinium [Pa] H01L2924/01092Uranium [U] H01L2924/01093Neptunium [Np] H01L2924/01094Plutonium [Pu] H01L2924/011Groups of the periodic table H01L2924/01101Alkali metals H01L2924/01102Alkali earth metals H01L2924/01103Transition metals H01L2924/01104Refractory metals H01L2924/01105Rare earth metals H01L2924/01106Lanthanides H01L2924/01107Actinides H01L2924/01108Noble metals H01L2924/01109Metalloids or Semi-metals H01L2924/0111Chalcogens H01L2924/01111Halogens H01L2924/01112Noble gases H01L2924/012Semiconductor purity grades H01L2924/012011N purity grades H01L2924/012022N purity grades H01L2924/012033N purity grades H01L2924/012044N purity grades H01L2924/012055N purity grades H01L2924/012066N purity grades H01L2924/012077N purity grades H01L2924/012088N purity grades H01L2924/013Alloys H01L2924/0132Binary Alloys H01L2924/01321Isomorphous Alloys H01L2924/01322Eutectic Alloys H01L2924/01323Hypoeutectic alloys H01L2924/01324Hypereutectic alloys H01L2924/01325Peritectic Alloys H01L2924/01326Monotectics H01L2924/01327Intermediate phases H01L2924/0133Ternary Alloys H01L2924/0134Quaternary Alloys H01L2924/0135Quinary Alloys H01L2924/014Solder alloys H01L2924/01402Invar H01L2924/01403Kovar H01L2924/01404Alloy 42 H01L2924/01405Inovco H01L2924/042Borides composed of metals from groups of the periodic table H01L2924/04211st Group H01L2924/04222nd Group H01L2924/04233rd Group H01L2924/04244th Group H01L2924/04255th Group H01L2924/04266th Group H01L2924/04277th Group H01L2924/04288th Group H01L2924/04299th Group H01L2924/04410th Group H01L2924/044111th Group H01L2924/044212th Group H01L2924/044313th Group H01L2924/044414th Group H01L2924/0445Lanthanides H01L2924/0446Actinides H01L2924/0449being a combination of two or more materials provided in the groups H01L2924/0421 - H01L2924/0446 H01L2924/04491having a monocrystalline microstructure H01L2924/04492having a polycrystalline microstructure H01L2924/04494having an amorphous microstructure H01L2924/045Carbides composed of metals from groups of the periodic table H01L2924/04511st Group H01L2924/04522nd Group H01L2924/04533rd Group H01L2924/04544th Group H01L2924/04541TiC H01L2924/04555th Group H01L2924/04566th Group H01L2924/04563WC H01L2924/04577th Group H01L2924/04588th Group H01L2924/04599th Group H01L2924/04610th Group H01L2924/046111th Group H01L2924/046212th Group H01L2924/046313th Group H01L2924/046414th Group H01L2924/04642SiC H01L2924/0465Lanthanides H01L2924/0466Actinides H01L2924/0469being a combination of two or more materials provided in the groups H01L2924/0451 - H01L2924/0466 H01L2924/04691having a monocrystalline microstructure H01L2924/04692having a polycrystalline microstructure H01L2924/04694having an amorphous microstructure H01L2924/047Silicides composed of metals from groups of the periodic table H01L2924/04711st Group H01L2924/04722nd Group H01L2924/04733rd Group H01L2924/04744th Group H01L2924/04755th Group H01L2924/04766th Group H01L2924/04777th Group H01L2924/04788th Group H01L2924/04799th Group H01L2924/04810th Group H01L2924/048111th Group H01L2924/048212th Group H01L2924/048313th Group H01L2924/048414th Group H01L2924/0485Lanthanides H01L2924/0486Actinides H01L2924/0489being a combination of two or more materials provided in the groups H01L2924/0471 - H01L2924/0486 H01L2924/04891having a monocrystalline microstructure H01L2924/04892having a polycrystalline microstructure H01L2924/04894having an amorphous microstructure H01L2924/049Nitrides composed of metals from groups of the periodic table H01L2924/04911st Group H01L2924/04922nd Group H01L2924/04933rd Group H01L2924/04944th Group H01L2924/04941TiN H01L2924/04955th Group H01L2924/04953TaN H01L2924/04966th Group H01L2924/04977th Group H01L2924/04988th Group H01L2924/04999th Group H01L2924/0510th Group H01L2924/050111th Group H01L2924/050212th Group H01L2924/050313th Group H01L2924/05032AlN H01L2924/050414th Group H01L2924/05042Si3N4 H01L2924/0505Lanthanides H01L2924/0506Actinides H01L2924/0509being a combination of two or more materials provided in the groups H01L2924/0491 - H01L2924/0506 H01L2924/05091having a monocrystalline microstructure H01L2924/05092having a polycrystalline microstructure H01L2924/05094having an amorphous microstructure H01L2924/051Phosphides composed of metals from groups of the periodic table H01L2924/05111st Group H01L2924/05122nd Group H01L2924/05133rd Group H01L2924/05144th Group H01L2924/05155th Group H01L2924/05166th Group H01L2924/05177th Group H01L2924/05188th Group H01L2924/05199th Group H01L2924/05210th Group H01L2924/052111th Group H01L2924/052212th Group H01L2924/052313th Group H01L2924/052414th Group H01L2924/0525Lanthanides H01L2924/0526Actinides H01L2924/0529being a combination of two or more materials provided in the groups H01L2924/0511 - H01L2924/0526 H01L2924/05291having a monocrystalline microstructure H01L2924/05292having a polycrystalline microstructure H01L2924/05294having an amorphous microstructure H01L2924/053Oxides composed of metals from groups of the periodic table H01L2924/05311st Group H01L2924/05322nd Group H01L2924/05333rd Group H01L2924/05344th Group H01L2924/05341TiO2 H01L2924/05342ZrO2 H01L2924/05355th Group H01L2924/05366th Group H01L2924/05377th Group H01L2924/05388th Group H01L2924/05381FeOx H01L2924/05399th Group H01L2924/05410th Group H01L2924/054111th Group H01L2924/054212th Group H01L2924/054313th Group H01L2924/05432Al2O3 H01L2924/054414th Group H01L2924/05442SiO2 H01L2924/0545Lanthanides H01L2924/0546Actinides H01L2924/0549being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546 H01L2924/05491having a monocrystalline microstructure H01L2924/05492having a polycrystalline microstructure H01L2924/05494having an amorphous microstructure H01L2924/055Chalcogenides other than oxygen i.e.sulfides, selenides and tellurides composed of metals from groups of the periodic table H01L2924/05511st Group H01L2924/05522nd Group H01L2924/05533rd Group H01L2924/05544th Group H01L2924/05555th Group H01L2924/05566th Group H01L2924/05577th Group H01L2924/05588th Group H01L2924/05599th Group H01L2924/05610th Group H01L2924/056111th Group H01L2924/056212th Group H01L2924/056313th Group H01L2924/056414th Group H01L2924/0565Lanthanides H01L2924/0566Actinides H01L2924/0569being a combination of two or more materials provided in the groups H01L2924/0551 - H01L2924/0566 H01L2924/05691having a monocrystalline microstructure H01L2924/05692having a polycrystalline microstructure H01L2924/05694having an amorphous microstructure H01L2924/057Halides composed of metals from groups of the periodic table H01L2924/05711st Group H01L2924/05722nd Group H01L2924/05733rd Group H01L2924/05744th Group H01L2924/05755th Group H01L2924/05766th Group H01L2924/05777th Group H01L2924/05788th Group H01L2924/05799th Group H01L2924/05810th Group H01L2924/058111th Group H01L2924/058212th Group H01L2924/058313th Group H01L2924/058414th Group H01L2924/0585Lanthanides H01L2924/0586Actinides H01L2924/0589being a combination of two or more materials provided in the groups H01L2924/0571 - H01L2924/0586 H01L2924/05891having a monocrystalline microstructure H01L2924/05892having a polycrystalline microstructure H01L2924/05894having an amorphous microstructure H01L2924/059Being combinations of any of the materials from the groups H01L2924/042 - H01L2924/0584 H01L2924/05991having a monocrystalline microstructure H01L2924/05992having a polycrystalline microstructure H01L2924/05994having an amorphous microstructure H01L2924/06Polymers H01L2924/061Polyolefin polymer H01L2924/0615Styrenic polymer H01L2924/062Halogenated polymer H01L2924/0625Polyvinyl alchohol H01L2924/063Polyvinyl acetate H01L2924/0635Acrylic polymer H01L2924/064Graft polymer H01L2924/0645Block copolymer H01L2924/065ABS H01L2924/0655Polyacetal H01L2924/066Phenolic resin H01L2924/0665Epoxy resin H01L2924/067Polyphenylene H01L2924/0675Polyester H01L2924/068Polycarbonate H01L2924/0685Polyether H01L2924/069Polyurethane H01L2924/0695Polyamide H01L2924/07Polyamine or polyimide H01L2924/07001Polyamine H01L2924/07025Polyimide H01L2924/0705Sulfur containing polymer H01L2924/0715Polysiloxane H01L2924/078Adhesive characteristics other than chemical H01L2924/07802not being an ohmic electrical conductor H01L2924/0781being an ohmic electrical conductor H01L2924/07811Extrinsic H01L2924/07812Intrinsic H01L2924/0782being pressure sensitive H01L2924/095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715 H01L2924/0951Glass epoxy laminates H01L2924/09511FR-4 H01L2924/09512FR-5 H01L2924/09522G10 H01L2924/09523G11 H01L2924/096Cermets H01L2924/097Glass-ceramics H01L2924/09701Low temperature co-fired ceramic [LTCC] H01L2924/10Details of semiconductor or other solid state devices to be connected H01L2924/1011Structure H01L2924/1015Shape H01L2924/10155being other than a cuboid H01L2924/10156at the periphery H01L2924/10157at the active surface H01L2924/10158at the passive surface H01L2924/1016being a cuboid H01L2924/10161with a rectangular active surface H01L2924/10162with a square active surface H01L2924/1017being a sphere H01L2924/102Material of the semiconductor or solid state bodies H01L2924/1025Semiconducting materials H01L2924/10251Elemental semiconductors H01L2924/10252Germanium [Ge] H01L2924/10253Silicon [Si] H01L2924/10254Diamond [C] H01L2924/1026Compound semiconductors H01L2924/1027IV H01L2924/10271Silicon-germanium [SiGe] H01L2924/10272Silicon Carbide [SiC] H01L2924/1032III-V H01L2924/10321Aluminium antimonide [AlSb] H01L2924/10322Aluminium arsenide [AlAs] H01L2924/10323Aluminium nitride [AlN] H01L2924/10324Aluminium phosphide [AlP] H01L2924/10325Boron nitride [BN] H01L2924/10326Boron phosphide [BP] H01L2924/10327Boron arsenide [BAs, B12As2] H01L2924/10328Gallium antimonide [GaSb] H01L2924/10329Gallium arsenide [GaAs] H01L2924/1033Gallium nitride [GaN] H01L2924/10331Gallium phosphide [GaP] H01L2924/10332Indium antimonide [InSb] H01L2924/10333Indium arsenide [InAs] H01L2924/10334Indium nitride [InN] H01L2924/10335Indium phosphide [InP] H01L2924/10336Aluminium gallium arsenide [AlGaAs] H01L2924/10337Indium gallium arsenide [InGaAs] H01L2924/10338Indium gallium phosphide [InGaP] H01L2924/10339Aluminium indium arsenide [AlInAs] H01L2924/1034Aluminium indium antimonide [AlInSb] H01L2924/10341Gallium arsenide nitride [GaAsN] H01L2924/10342Gallium arsenide phosphide [GaAsP] H01L2924/10343Gallium arsenide antimonide [GaAsSb] H01L2924/10344Aluminium gallium nitride [AlGaN] H01L2924/10345Aluminium gallium phosphide [AlGaP] H01L2924/10346Indium gallium nitride [InGaN] H01L2924/10347Indium arsenide antimonide [InAsSb] H01L2924/10348Indium gallium antimonide [InGaSb] H01L2924/10349Aluminium gallium indium phosphide [AlGaInP] H01L2924/1035Aluminium gallium arsenide phosphide [AlGaInP] H01L2924/10351Indium gallium arsenide phosphide [InGaAsP] H01L2924/10352Indium gallium arsenide antimonide [InGaAsSb] H01L2924/10353Indium arsenide antimonide phosphide [InAsSbP] H01L2924/10354Aluminium indium arsenide phosphide [AlInAsP] H01L2924/10355Aluminium gallium arsenide nitride [AlGaAsN] H01L2924/10356Indium gallium arsenide nitride [InGaAsN] H01L2924/10357Indium aluminium arsenide nitride [InAlAsN] H01L2924/10358Gallium arsenide antimonide nitride [GaAsSbN] H01L2924/10359Gallium indium nitride arsenide antimonide [GaInNAsSb] H01L2924/1036Gallium indium arsenide antimonide phosphide [GaInAsSbP] H01L2924/1037II-VI H01L2924/10371Cadmium selenide [CdSe] H01L2924/10372Cadmium sulfide [CdS] H01L2924/10373Cadmium telluride [CdTe] H01L2924/10375Zinc selenide [ZnSe] H01L2924/10376Zinc sulfide [ZnS] H01L2924/10377Zinc telluride [ZnTe] H01L2924/10378Cadmium zinc telluride H01L2924/10379Mercury cadmium telluride [HgZnTe] H01L2924/1038Mercury zinc telluride [HgZnSe] H01L2924/10381Mercury zinc selenide [HgZnSe] H01L2924/1042I-VII H01L2924/10421Cuprous chloride [CuCl] H01L2924/1047I-VI H01L2924/10471Copper sulfide [CuS] H01L2924/1052IV-VI H01L2924/10521Lead selenide [PbSe] H01L2924/10522Lead(II)sulfide [PbS] H01L2924/10523Lead telluride [PbTe] H01L2924/10524Tin sulfide [SnS, SnS2] H01L2924/10525Tin telluride [SnTe] H01L2924/10526Lead tin telluride [PbSnTe] H01L2924/10527Thallium tin telluride [Tl2SnTe5] H01L2924/10528Thallium germanium telluride [Tl2GeTe5] H01L2924/1057V-VI H01L2924/10571Bismuth telluride [Bi2Te3] H01L2924/1062II-V H01L2924/10621Cadmium phosphide [Cd3P2] H01L2924/10622Cadmium arsenide [Cd3As2] H01L2924/10623Cadmium antimonide [Cd3Sb2] H01L2924/10624Zinc phosphide [Zn3P2] H01L2924/10625Zinc arsenide [Zn3As2] H01L2924/10626Zinc antimonide [Zn3Sb2] H01L2924/1067Oxide H01L2924/10671Titanium dioxide, anatase, rutile, brookite [TiO2] H01L2924/10672Copper(I)oxide [Cu2O] H01L2924/10673Copper(II)oxide [CuO] H01L2924/10674Uranium dioxide [UO2] H01L2924/10675Uranium trioxide [UO3] H01L2924/10676Bismuth trioxide [Bi2O3] H01L2924/10677Tin dioxide [SnO2] H01L2924/10678Barium titanate [BaTiO3] H01L2924/10679Strontium titanate [SrTiO3] H01L2924/1068Lithium niobate [LiNbO3] H01L2924/10681Lanthanum copper oxide [La2CuO4] H01L2924/1072Layered H01L2924/10721Lead(II)iodide [PbI2] H01L2924/10722Molybdenum disulfide [MoS2] H01L2924/10723Gallium selenide [GaSe] H01L2924/10724Tin sulfide [SnS] H01L2924/10725Bismuth sulfide [Bi2S3] H01L2924/1077Magnetic diluted [DMS] H01L2924/10771Gallium manganese arsenide [GaMnAs] H01L2924/10772Indium manganese arsenide [InMnAs] H01L2924/10773Cadmium manganese telluride [CdMnTe] H01L2924/10774Lead manganese telluride [PbMnTe] H01L2924/10775Lanthanum calcium manganate [La0.7Ca0.3MnO3] H01L2924/10776Iron(II)oxide [FeO] H01L2924/10777Nickel(II)oxide [NiO] H01L2924/10778Europium(II)oxide [EuO] H01L2924/10779Europium(II)sulfide [EuS] H01L2924/1078Chromium(III)bromide [CrBr3] H01L2924/1082Other H01L2924/10821Copper indium gallium selenide, CIGS [Cu[In,Ga]Se2] H01L2924/10822Copper zinc tin sulfide, CZTS [Cu2ZnSnS4] H01L2924/10823Copper indium selenide, CIS [CuInSe2] H01L2924/10824Silver gallium sulfide [AgGaS2] H01L2924/10825Zinc silicon phosphide [ZnSiP2] H01L2924/10826Arsenic selenide [As2S3] H01L2924/10827Platinum silicide [PtSi] H01L2924/10828Bismuth(III)iodide [BiI3] H01L2924/10829Mercury(II)iodide [HgI2] H01L2924/1083Thallium(I)bromide [TlBr] H01L2924/10831Selenium [Se] H01L2924/10832Silver sulfide [Ag2S] H01L2924/10833Iron disulfide [FeS2] H01L2924/11Device type H01L2924/12Passive devices H01L2924/1203Rectifying Diode H01L2924/12031PIN diode H01L2924/12032Schottky diode H01L2924/12033Gunn diode H01L2924/12034Varactor H01L2924/12035Zener diode H01L2924/12036PN diode H01L2924/12037Cat's whisker diode H01L2924/12038Point contact H01L2924/1204Optical Diode H01L2924/12041LED H01L2924/12042LASER H01L2924/12043Photo diode H01L2924/12044OLED H01L2924/1205Capacitor H01L2924/1206Inductor H01L2924/1207Resistor H01L2924/13Discrete devices H01L2924/1301Thyristor H01L2924/13011Anode Gate Thyristor [AGT] H01L2924/13013Bidirectional Control Thyristor [BCT] H01L2924/13014Breakover Diode [BOD] H01L2924/13015DIAC - Bidirectional trigger device H01L2924/13016Dynistor - Unidirectional switching device H01L2924/13017Shockley diode - Unidirectional trigger and switching device H01L2924/13018SIDAC - Bidirectional switching device H01L2924/13019Trisil, SIDACtor - Bidirectional protection devices H01L2924/1302GTO - Gate Turn-Off thyristor H01L2924/13021DB-GTO - Distributed Buffer Gate Turn-Off thyristor H01L2924/13022MA-GTO - Modified Anode Gate Turn-Off thyristor H01L2924/13023IGCT - Integrated Gate Commutated Thyristor H01L2924/13024LASCR - Light Activated SCR, or LTT - Light triggered thyristor H01L2924/13025Light Activated Semiconducting Switch [LASS] H01L2924/13026MCT - MOSFET Controlled Thyristor - It contains two additional FET structures for on/off control H01L2924/13027BRT - Base Resistance Controlled Thyristor H01L2924/13028RCT - Reverse Conducting Thyristor H01L2924/13029PUT or PUJT - Programmable Unijunction Transistor - A thyristor with gate on n-type layer near to the anode used as a functional replacement for unijunction transistor H01L2924/1303SCS - Silicon Controlled Switch or Thyristor Tetrode - A thyristor with both cathode and anode gates H01L2924/13032SITh - Static Induction Thyristor, or FCTh - Field Controlled Thyristor - containing a gate structure that can shut down anode current flow H01L2924/13033TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact H01L2924/13034Silicon Controlled Rectifier [SCR] H01L2924/13035Asymmetrical SCR [ASCR] H01L2924/1304Transistor H01L2924/1305Bipolar Junction Transistor [BJT] H01L2924/13051Heterojunction bipolar transistor [HBT] H01L2924/13052Schottky transistor H01L2924/13053Avalanche transistor H01L2924/13054Darlington transistor H01L2924/13055Insulated gate bipolar transistor [IGBT] H01L2924/13056Photo transistor H01L2924/1306Field-effect transistor [FET] H01L2924/13061Carbon nanotube field-effect transistor [CNFET] H01L2924/13062Junction field-effect transistor [JFET] H01L2924/13063Metal-Semiconductor Field-Effect Transistor [MESFET] H01L2924/13064High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET] H01L2924/13066Inverted-T field effect transistor [ITFET] H01L2924/13067FinFET, source/drain region shapes fins on the silicon surface H01L2924/13068Fast-reverse epitaxial diode field-effect transistor [FREDFET] H01L2924/13069Thin film transistor [TFT] H01L2924/1307Organic Field-Effect Transistor [OFET] H01L2924/13071Ballistic transistor H01L2924/13072Sensor FET H01L2924/13073ion-sensitive field-effect transistor [ISFET] H01L2924/13074Electrolyte-oxide-semiconductor field effect transistor [EOSFET] H01L2924/13075Deoxyribonucleic acid field-effect transistor [DNAFET] H01L2924/13076DEPFET H01L2924/13078Unijunction transistors H01L2924/13079Single-electron transistors [SET] H01L2924/1308Nanofluidic transistor H01L2924/13081Multigate devices H01L2924/13082Tetrode transistor H01L2924/13083Pentode transistor H01L2924/13084Trigate transistor H01L2924/13085Dual gate FETs H01L2924/13086Junctionless Nanowire Transistor [JNT] H01L2924/13087Vertical-Slit Field-Effect Transistor [VeSFET] H01L2924/13088Graphene Nanoribbon Field-Effect Transistor [GNRFET] H01L2924/13089Nanoparticle Organic Memory Field-Effect Transistor [NOMFET] H01L2924/1309Modulation-Doped Field Effect Transistor [MODFET] H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET] H01L2924/13092Dual Gate Metal-Oxide-Semiconductor Field-Effect Transistor [DGMOSFET] H01L2924/14Integrated circuits H01L2924/141Analog devices H01L2924/142HF devices H01L2924/1421RF devices H01L2924/14211Voltage-controlled oscillator [VCO] H01L2924/14215Low-noise amplifier [LNA] H01L2924/1422Mixer H01L2924/14221Electronic mixer H01L2924/14222Frequency mixer H01L2924/1423Monolithic Microwave Integrated Circuit [MMIC] H01L2924/1424Operational amplifier H01L2924/1425Converter H01L2924/14251Frequency converter H01L2924/14252Voltage converter H01L2924/14253Digital-to-analog converter [DAC] H01L2924/1426Driver H01L2924/1427Voltage regulator [VR] H01L2924/143Digital devices H01L2924/1431Logic devices H01L2924/1432Central processing unit [CPU] H01L2924/1433Application-specific integrated circuit [ASIC] H01L2924/14335Digital signal processor [DSP] H01L2924/1434Memory H01L2924/1435Random access memory [RAM] H01L2924/1436Dynamic random-access memory [DRAM] H01L2924/14361Synchronous dynamic random access memory [SDRAM] H01L2924/14362RAS Only Refresh [ROR] H01L2924/14363CAS before RAS refresh [CBR] H01L2924/14364Multibank DRAM [MDRAM] H01L2924/14365Video DRAM [VRAM] H01L2924/14366Window DRAM [WRAM] H01L2924/14367Fast page mode DRAM [FPM DRAM] H01L2924/14368Extended data out DRAM [EDO DRAM] H01L2924/14369Burst EDO DRAM [BEDO DRAM] H01L2924/1437Static random-access memory [SRAM] H01L2924/1438Flash memory H01L2924/1441Ferroelectric RAM [FeRAM or FRAM] H01L2924/1442Synchronous graphics RAM [SGRAM] H01L2924/1443Non-volatile random-access memory [NVRAM] H01L2924/1444PBRAM H01L2924/145Read-only memory [ROM] H01L2924/1451EPROM H01L2924/14511EEPROM H01L2924/1453PROM H01L2924/146Mixed devices H01L2924/1461MEMS H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected H01L2924/151Die mounting substrate H01L2924/1511Structure H01L2924/1515Shape H01L2924/15151the die mounting substrate comprising an aperture H01L2924/15153the die mounting substrate comprising a recess for hosting the device H01L2924/15155the shape of the recess being other than a cuboid H01L2924/15156Side view H01L2924/15157Top view H01L2924/15158the die mounting substrate being other than a cuboid H01L2924/15159Side view H01L2924/15162Top view H01L2924/15165Monolayer substrate H01L2924/1517Multilayer substrate H01L2924/15172Fan-out arrangement of the internal vias H01L2924/15173in a single layer of the multilayer substrate H01L2924/15174in different layers of the multilayer substrate H01L2924/15182Fan-in arrangement of the internal vias H01L2924/15183in a single layer of the multilayer substrate H01L2924/15184in different layers of the multilayer substrate H01L2924/15192Resurf arrangement of the internal vias H01L2924/152Disposition H01L2924/153Connection portion H01L2924/1531the connection portion being formed only on the surface of the substrate opposite to the die mounting surface H01L2924/15311being a ball array H01L2924/15312being a pin array H01L2924/15313being a land array H01L2924/1532the connection portion being formed on the die mounting surface of the substrate H01L2924/15321being a ball array H01L2924/15322being a pin array H01L2924/15323being a land array H01L2924/1533the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate H01L2924/15331being a ball array H01L2924/15332being a pin array H01L2924/15333being a land array H01L2924/156Material H01L2924/157with a principal constituent of the material being a metal or a metalloid H01L2924/15701the principal constituent melting at a temperature of less than 400 C H01L2924/15717the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C H01L2924/15724Aluminium [Al] as principal constituent H01L2924/15738the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C H01L2924/15747Copper [Cu] as principal constituent H01L2924/1576Iron [Fe] as principal constituent H01L2924/15763the principal constituent melting at a temperature of greater than 1550 C H01L2924/15786with a principal constituent of the material being a non metallic, non metalloid inorganic material H01L2924/15787Ceramics H01L2924/15788Glasses H01L2924/1579with a principal constituent of the material being a polymer H01L2924/15791The principal constituent being an elastomer H01L2924/15793with a principal constituent of the material being a solid not provided for in groups H01L2924/157 - H01L2924/15791 H01L2924/15798with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material H01L2924/161Cap H01L2924/1611Structure H01L2924/1615Shape H01L2924/16151Cap comprising an aperture H01L2924/16152Cap comprising a cavity for hosting the device H01L2924/16153Cap enclosing a plurality of side-by-side cavities [ H01L2924/1616Cavity shape H01L2924/1617Cavity coating H01L2924/16171Material H01L2924/16172with a principal constituent of the material being a metal or a metalloid H01L2924/16173with a principal constituent of the material being a non metallic, non metalloid inorganic material H01L2924/16174Ceramics H01L2924/16175Glasses H01L2924/16176with a principal constituent of the material being a polymer H01L2924/16177The principal constituent being an elastomer H01L2924/16178with a principal constituent of the material being a solid not provided for in groups H01L2924/157 - H01L2924/15791 H01L2924/16179with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material H01L2924/1619Cavity coating shape H01L2924/16195Flat cap [not enclosing an internal cavity] H01L2924/16196Cap forming a cavity H01L2924/162Disposition H01L2924/16235Connecting to a semiconductor or solid-state bodies H01L2924/16251Connecting to an item not being a semiconductor or solid-state body H01L2924/1626Cap-in-cap assemblies H01L2924/1627stacked type assemblies H01L2924/163Connection portion H01L2924/1631Structure H01L2924/16315Shape H01L2924/1632Disposition H01L2924/164Material H01L2924/165with a principal constituent of the material being a metal or a metalloid H01L2924/16586with a principal constituent of the material being a non metallic, non metalloid inorganic material H01L2924/16587Ceramics H01L2924/16588Glasses H01L2924/1659with a principal constituent of the material being a polymer H01L2924/16593with a principal constituent of the material being a solid not provided for in groups H01L2924/157 - H01L2924/15791 H01L2924/16598with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material H01L2924/166Material H01L2924/167with a principal constituent of the material being a metal or a metalloid H01L2924/16701the principal constituent melting at a temperature of less than 400 C H01L2924/16717the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C H01L2924/16724Aluminium [Al] as principal constituent H01L2924/16738the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C H01L2924/16747Copper [Cu] as principal constituent H01L2924/1676Iron [Fe] as principal constituent H01L2924/16763the principal constituent melting at a temperature of greater than 1550 C H01L2924/16786with a principal constituent of the material being a non metallic, non metalloid inorganic material H01L2924/16787Ceramics H01L2924/16788Glasses H01L2924/1679with a principal constituent of the material being a polymer H01L2924/16791The principal constituent being an elastomer H01L2924/16793with a principal constituent of the material being a solid not provided for in groups H01L2924/167 - H01L2924/16791 H01L2924/16798with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material H01L2924/171Frame H01L2924/1711Structure H01L2924/1715Shape H01L2924/17151Frame comprising an aperture H01L2924/172Disposition H01L2924/173Connection portion H01L2924/176Material H01L2924/177with a principal constituent of the material being a metal or a metalloid H01L2924/17701the principal constituent melting at a temperature of less than 400 C H01L2924/17717the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C H01L2924/17724Aluminium [Al] as principal constituent H01L2924/17738the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C H01L2924/17747Copper [Cu] as principal constituent H01L2924/1776Iron [Fe] as principal constituent H01L2924/17763the principal constituent melting at a temperature of greater than 1550 C H01L2924/17786with a principal constituent of the material being a non metallic, non metalloid inorganic material H01L2924/17787Ceramics H01L2924/17788Glasses H01L2924/1779with a principal constituent of the material being a polymer H01L2924/17791The principal constituent being an elastomer H01L2924/17793with a principal constituent of the material being a solid not provided for in groups H01L2924/177 - H01L2924/17791 H01L2924/17798with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material H01L2924/181Encapsulation H01L2924/1811Structure H01L2924/1815Shape H01L2924/1816Exposing the passive side of the semiconductor or solid-state body H01L2924/18161of a flip chip H01L2924/18162of a chip with build-up interconnect H01L2924/18165of a wire bonded chip H01L2924/182Disposition H01L2924/183Connection portion H01L2924/18301being an anchoring portion H01L2924/186Material H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected H01L2924/1901Structure H01L2924/19011including integrated passive components H01L2924/19015including thin film passive components H01L2924/1902including thick film passive components H01L2924/1903including wave guides H01L2924/19031being a strip line type H01L2924/19032being a microstrip line type H01L2924/19033being a coplanar line type H01L2924/19038being a hybrid line type H01L2924/19039impedance transition between different types of wave guides H01L2924/1904Component type H01L2924/19041being a capacitor H01L2924/19042being an inductor H01L2924/19043being a resistor H01L2924/1905Shape H01L2924/19051Impedance matching structure [ H01L2924/191Disposition H01L2924/19101of discrete passive components H01L2924/19102in a stacked assembly with the semiconductor or solid state device H01L2924/19103interposed between the semiconductor or sold-state device and the die mounting substrate [ H01L2924/19104on the semiconductor or sold-state device [ H01L2924/19105in a side-by-side arrangement on a common die mounting substrate H01L2924/19106in a mirrored arrangement on two different side of a common die mounting substrate H01L2924/19107off-chip wires H01L2924/20Parameters H01L2924/201Temperature ranges H01L2924/20101Temperature range T<0 C, T<273.15 K H01L2924/20102Temperature range 0 C=<T<60 C, 273.15 K =<T< 333.15K H01L2924/20103Temperature range 60 C=<T<100 C, 333.15 K =< T< 373.15K H01L2924/20104Temperature range 100 C=<T<150 C, 373.15 K =< T < 423.15K H01L2924/20105Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K H01L2924/20106Temperature range 200 C=<T<250 C, 473.15 K =<T < 523.15K H01L2924/20107Temperature range 250 C=<T<300 C, 523.15K =<T< 573.15K H01L2924/20108Temperature range 300 C=<T<350 C, 573.15K =<T< 623.15K H01L2924/20109Temperature range 350 C=<T<400 C, 623.15K =<T< 673.15K H01L2924/2011Temperature range 400 C=<T<450 C, 673.15K =<T< 723.15K H01L2924/20111Temperature range 450 C=<T<500 C, 723.15K =<T< 773.15K H01L2924/202Electromagnetic wavelength ranges [W] H01L2924/20201Gamma radiation H01L2924/20202X-ray radiation H01L2924/2021Ultraviolet radiation H01L2924/20211UV-C 100=<W<280 nm H01L2924/20212UV-B 280=<W<315 nm H01L2924/20213UV-A 315=<W<400 nm H01L2924/2024Visible spectrum wavelength 390=<W<700 nm H01L2924/2026Infrared radiation 700=<W<3000 nm H01L2924/20261IR-A 700=<W<1400 nm H01L2924/20262IR-B 1400=<W<3000 nm H01L2924/20263IR-C 3000 nm =<W<1 mm H01L2924/2027Radio 1 mm - km 300 GHz - 3 Hz H01L2924/20271Microwave radiation 1 mm - 1 meter, i..e 300 GHz - 300 MHz H01L2924/203Ultrasonic frequency ranges H01L2924/20301Ultrasonic frequency [f] f<25 kHz H01L2924/20302Ultrasonic frequency [f] 25 Khz=<f< 50 KHz H01L2924/20303Ultrasonic frequency [f] 50 Khz=<f< 75 KHz H01L2924/20304Ultrasonic frequency [f] 75 Khz=<f< 100 KHz H01L2924/20305Ultrasonic frequency [f] 100 Khz=<f< 125 KHz H01L2924/20306Ultrasonic frequency [f] 125 Khz=<f< 150 KHz H01L2924/20307Ultrasonic frequency [f] 150 Khz=<f< 175 KHz H01L2924/20308Ultrasonic frequency [f] 175 Khz=<f< 200 KHz H01L2924/20309Ultrasonic frequency [f] f>=200 KHz H01L2924/206Length ranges H01L2924/2064larger or equal to 1 micron less than 100 microns H01L2924/20641larger or equal to 100 microns less than 200 microns H01L2924/20642larger or equal to 200 microns less than 300 microns H01L2924/20643larger or equal to 300 microns less than 400 microns H01L2924/20644larger or equal to 400 microns less than 500 microns H01L2924/20645larger or equal to 500 microns less than 600 microns H01L2924/20646larger or equal to 600 microns less than 700 microns H01L2924/20647larger or equal to 700 microns less than 800 microns H01L2924/20648larger or equal to 800 microns less than 900 microns H01L2924/20649larger or equal to 900 microns less than 1000 microns H01L2924/2065larger or equal to 1000 microns less than 1500 microns H01L2924/20651larger or equal to 1500 microns less than 2000 microns H01L2924/20652larger or equal to 2000 microns less than 2500 microns H01L2924/20653larger or equal to 2500 microns less than 3000 microns H01L2924/20654larger or equal to 3000 microns less than 4000 microns H01L2924/20655larger or equal to 4000 microns less than 5000 microns H01L2924/20656larger or equal to 5000 microns less than 6000 microns H01L2924/20657larger or equal to 6000 microns less than 7000 microns H01L2924/20658larger or equal to 7000 microns less than 8000 microns H01L2924/207Diameter ranges H01L2924/2075larger or equal to 1 micron less than 10 microns H01L2924/20751larger or equal to 10 microns less than 20 microns H01L2924/20752larger or equal to 20 microns less than 30 microns H01L2924/20753larger or equal to 30 microns less than 40 microns H01L2924/20754larger or equal to 40 microns less than 50 microns H01L2924/20755larger or equal to 50 microns less than 60 microns H01L2924/20756larger or equal to 60 microns less than 70 microns H01L2924/20757larger or equal to 70 microns less than 80 microns H01L2924/20758larger or equal to 80 microns less than 90 microns H01L2924/20759larger or equal to 90 microns less than 100 microns H01L2924/2076equal to or larger than 100 microns H01L2924/30Technical effects H01L2924/301Electrical effects H01L2924/30101Resistance H01L2924/30105Capacitance H01L2924/30107Inductance H01L2924/3011Impedance H01L2924/30111matching H01L2924/302Electrostatic H01L2924/30201Charge H01L2924/30205Discharge H01L2924/3025Electromagnetic shielding H01L2924/35Mechanical effects H01L2924/351Thermal stress H01L2924/3511Warping H01L2924/3512Cracking H01L2924/35121Peeling or delaminating H01L2924/36Material effects H01L2924/364Polymers H01L2924/3641Outgassing H01L2924/365Metallurgical effects H01L2924/3651Formation of intermetallics H01L2924/36511Purple plague H01L2924/3656Formation of Kirkendall voids H01L2924/37Effects of the manufacturing process H01L2924/37001Yield H01L2924/37002Shelf life H01L2924/3701increased through put H01L2924/38Effects and problems related to the device integration H01L2924/381Pitch distance H01L2924/384Bump effects H01L2924/3841Solder bridging H01L2924/386Wire effects H01L2924/3861Sag H01L2924/3862Sweep H01L2924/40Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body H01L2924/401LASER H01L2924/40101Mode H01L2924/40102being pulsed H01L2924/40103being continous H01L2924/40105Beam details H01L2924/4015Shape H01L2924/402Type H01L2924/40201being a chemical H01L2924/40202Deuterium Flouride [DF] LASER H01L2924/40203Hydrogen Flouride [HF] LASER H01L2924/40207Dye laser H01L2924/4025being a gas H01L2924/40251argon-ion LASER H01L2924/40252CO2 LASER H01L2924/40253HeAg LASER H01L2924/40254HeNe LASER H01L2924/40255NeCu LASER H01L2924/403being an Excimer H01L2924/40301ArF LASER H01L2924/40302F2 LASER H01L2924/40303KrCl LASER H01L2924/40304KrF LASER H01L2924/40305XeCl LASER H01L2924/40306XeF LASER H01L2924/4035being a fiber hosted LASER H01L2924/404being a solid state H01L2924/40401Free electron LASER H01L2924/40402Photonic crystal LASER H01L2924/40403Fiber solid state LASER H01L2924/40404Yttrium Aluminium Garnet Nd:YAG LASER H01L2924/40405Yttrium Lithium Flouride Nd:YLF LASER H01L2924/40406Ruby LASER H01L2924/40407Yb:YAG LASER H01L2924/405Wavelength H01L2924/40501UV spectrum H01L2924/40502Visible spectrum H01L2924/40503IR spectrum