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Discharge tubes exposing object to beam
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H01J2237/00
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
Current Industry
H01J2237/00
Discharge tubes exposing object to beam
Sub Industries
H01J2237/002
Cooling arrangements
H01J2237/004
Charge control of objects or beams
H01J2237/0041
Neutralising arrangements
H01J2237/0042
Deflection of neutralising particles
H01J2237/0044
of objects being observed or treated
H01J2237/0045
using secondary electrons
H01J2237/0047
using electromagnetic radiations
H01J2237/0048
Charging arrangements
H01J2237/006
Details of gas supplies -
H01J2237/02
Details
H01J2237/0203
Protection arrangements
H01J2237/0206
Extinguishing, preventing or controlling unwanted discharges
H01J2237/0209
Avoiding or diminishing effects of eddy currents
H01J2237/0213
Avoiding deleterious effects due to interactions between particles and tube elements
H01J2237/0216
Means for avoiding or correcting vibration effects
H01J2237/022
Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
H01J2237/0225
Detecting or monitoring foreign particles
H01J2237/024
Moving components not otherwise provided for
H01J2237/0245
Moving whole optical system relatively to object
H01J2237/026
Shields
H01J2237/0262
electrostatic
H01J2237/0264
magnetic
H01J2237/0266
electromagnetic
H01J2237/0268
Liner tubes
H01J2237/028
Particle traps
H01J2237/03
Mounting, supporting, spacing or insulating electrodes
H01J2237/032
Mounting or supporting
H01J2237/036
Spacing
H01J2237/038
Insulating
H01J2237/04
Means for controlling the discharge
H01J2237/041
Beam polarising means
H01J2237/043
Beam blanking
H01J2237/0432
High speed and short duration
H01J2237/0435
Multi-aperture
H01J2237/0437
Semiconductor substrate
H01J2237/045
Diaphragms
H01J2237/0451
with fixed aperture
H01J2237/0453
multiple apertures
H01J2237/0455
with variable aperture
H01J2237/0456
Supports
H01J2237/0458
movable
H01J2237/047
Changing particle velocity
H01J2237/0473
accelerating
H01J2237/04732
with magnetic means
H01J2237/04735
with electrostatic means
H01J2237/04737
radio-frequency quadrupole [RFQ]
H01J2237/0475
decelerating
H01J2237/04753
with magnetic means
H01J2237/04756
with electrostatic means
H01J2237/049
Focusing means
H01J2237/0492
Lens systems
H01J2237/04922
electromagnetic
H01J2237/04924
electrostatic
H01J2237/04926
combined
H01J2237/04928
Telecentric systems
H01J2237/05
Arrangements for energy or mass analysis
H01J2237/053
electrostatic
H01J2237/0535
Mirror analyser
H01J2237/055
magnetic
H01J2237/057
Energy or mass filtering
H01J2237/06
Sources
H01J2237/061
Construction
H01J2237/062
Reducing size of gun
H01J2237/063
Electron sources
H01J2237/06308
Thermionic sources
H01J2237/06316
Schottky emission
H01J2237/06325
Cold-cathode sources
H01J2237/06333
Photo emission
H01J2237/06341
Field emission
H01J2237/0635
Multiple source
H01J2237/06358
Secondary emission
H01J2237/06366
Gas discharge electron sources
H01J2237/06375
Arrangement of electrodes
H01J2237/06383
Spin polarised electron sources
H01J2237/06391
Positron sources
H01J2237/065
Source emittance characteristics
H01J2237/0653
Intensity
H01J2237/0656
Density
H01J2237/08
Ion sources
H01J2237/0802
Field ionization sources
H01J2237/0805
Liquid metal sources
H01J2237/0807
Gas field ion sources [GFIS]
H01J2237/081
Sputtering sources
H01J2237/0812
Ionized cluster beam [ICB] sources
H01J2237/0815
Methods of ionisation
H01J2237/0817
Microwaves
H01J2237/082
Electron beam
H01J2237/0822
Multiple sources
H01J2237/0825
for producing different ions simultaneously
H01J2237/0827
for producing different ions sequentially
H01J2237/083
Beam forming
H01J2237/0835
Variable cross-section or shape
H01J2237/10
Lenses
H01J2237/103
characterised by lens type
H01J2237/1035
Immersion lens
H01J2237/12
electrostatic
H01J2237/1202
Associated circuits
H01J2237/1205
Microlenses
H01J2237/1207
Einzel lenses
H01J2237/121
characterised by shape
H01J2237/1215
Annular electrodes
H01J2237/14
magnetic
H01J2237/1405
Constructional details
H01J2237/141
Coils
H01J2237/1415
Bores or yokes
H01J2237/142
with superconducting coils
H01J2237/15
Means for deflecting or directing discharge
H01J2237/1501
Beam alignment means or procedures
H01J2237/1502
Mechanical adjustments
H01J2237/1503
Mechanical scanning
H01J2237/1504
Associated circuits
H01J2237/1505
Rotating beam around optical axis
H01J2237/1506
Tilting or rocking beam around an axis substantially at an angle to optical axis
H01J2237/1507
dynamically
H01J2237/1508
Combined electrostatic-electromagnetic means
H01J2237/151
Electrostatic means
H01J2237/1512
Travelling wave deflectors
H01J2237/1514
Prisms
H01J2237/1516
Multipoles
H01J2237/1518
for X-Y scanning
H01J2237/152
Magnetic means
H01J2237/1523
Prisms
H01J2237/1526
For X-Y scanning
H01J2237/153
Correcting image defects
H01J2237/1532
Astigmatism
H01J2237/1534
Aberrations
H01J2237/1536
Image distortions due to scanning
H01J2237/1538
Space charge (Boersch) effect compensation
H01J2237/16
Vessels
H01J2237/162
Open vessel
H01J2237/164
Particle-permeable windows
H01J2237/166
Sealing means
H01J2237/18
Vacuum control means
H01J2237/182
Obtaining or maintaining desired pressure
H01J2237/1825
Evacuating means
H01J2237/184
Vacuum locks
H01J2237/186
Valves
H01J2237/188
Differential pressure
H01J2237/20
Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
H01J2237/2001
Maintaining constant desired temperature
H01J2237/2002
Controlling environment of sample
H01J2237/2003
Environmental cells
H01J2237/2004
Biological samples
H01J2237/2005
Seal mechanisms
H01J2237/2006
Vacuum seals
H01J2237/2007
Holding mechanisms
H01J2237/2008
specially adapted for studying electrical or magnetical properties of objects
H01J2237/201
for mounting multiple objects
H01J2237/202
Movement
H01J2237/20207
Tilt
H01J2237/20214
Rotation
H01J2237/20221
Translation
H01J2237/20228
Mechanical X-Y scanning
H01J2237/20235
Z movement or adjustment
H01J2237/20242
Eucentric movement
H01J2237/2025
Sensing velocity of translation or rotation
H01J2237/20257
Magnetic coupling
H01J2237/20264
Piezoelectric devices
H01J2237/20271
Temperature responsive devices
H01J2237/20278
Motorised movement
H01J2237/20285
computer-controlled
H01J2237/20292
Means for position and/or orientation registration
H01J2237/204
Means for introducing and/or outputting objects
H01J2237/206
Modifying objects while observing
H01J2237/2062
Mechanical constraints
H01J2237/2065
Temperature variations
H01J2237/2067
Surface alteration
H01J2237/208
Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof
H01J2237/21
Focus adjustment
H01J2237/213
during electron or ion beam welding or cutting
H01J2237/216
Automatic focusing methods
H01J2237/22
Treatment of data
H01J2237/221
Image processing
H01J2237/223
Fourier techniques
H01J2237/225
Displaying image using synthesised colours
H01J2237/226
Image reconstruction
H01J2237/228
Charged particle holography
H01J2237/244
Detection characterized by the detecting means
H01J2237/24405
Faraday cages
H01J2237/2441
Semiconductor detectors
H01J2237/24415
X-ray
H01J2237/2442
Energy-dispersive (Si-Li type) spectrometer
H01J2237/24425
Wavelength-dispersive spectrometer
H01J2237/2443
Scintillation detectors
H01J2237/24435
Microchannel plates
H01J2237/2444
Electron Multiplier
H01J2237/24445
using avalanche in a gas
H01J2237/2445
Photon detectors for X-rays, light
H01J2237/24455
Transmitted particle detectors
H01J2237/2446
Position sensitive detectors
H01J2237/24465
Sectored detectors
H01J2237/2447
Imaging plates
H01J2237/24475
Scattered electron detectors
H01J2237/2448
Secondary particle detectors
H01J2237/24485
Energy spectrometers
H01J2237/2449
Detector devices with moving charges in electric or magnetic fields
H01J2237/24495
Signal processing
H01J2237/245
Detection characterised by the variable being measured
H01J2237/24507
Intensity, dose or other characteristics of particle beams or electromagnetic radiation
H01J2237/24514
Beam diagnostics including control of the parameter or property diagnosed
H01J2237/24521
Beam diameter
H01J2237/24528
Direction of beam or parts thereof in view of the optical axis
H01J2237/24535
Beam current
H01J2237/24542
Beam profile
H01J2237/2455
Polarisation (electromagnetic beams)
H01J2237/24557
Spin polarisation (particles)
H01J2237/24564
Measurements of electric or magnetic variables
H01J2237/24571
Measurements of non-electric or non-magnetic variables
H01J2237/24578
Spatial variables
H01J2237/24585
Other variables
H01J2237/24592
Inspection and quality control of devices
H01J2237/248
Components associated with the control of the tube
H01J2237/2482
Optical means
H01J2237/2485
Electric or electronic means
H01J2237/2487
using digital signal processors
H01J2237/25
Tubes for localised analysis using electron or ion beams
H01J2237/2505
characterised by their application
H01J2237/2511
Auger spectrometers
H01J2237/2516
Secondary particles mass or energy spectrometry
H01J2237/2522
of electrons (ESCA, XPS)
H01J2237/2527
Ions [SIMS]
H01J2237/2533
Neutrals [SNMS]
H01J2237/2538
Low energy electron microscopy [LEEM]
H01J2237/2544
Diffraction [LEED]
H01J2237/255
Reflection diffraction [RHEED]
H01J2237/2555
Microprobes
H01J2237/2561
electron
H01J2237/2566
ion
H01J2237/2572
proton
H01J2237/2577
atomic
H01J2237/2583
using tunnel effects
H01J2237/2588
Lorenz microscopy (magnetic field measurement)
H01J2237/2594
Measuring electric fields or potentials
H01J2237/26
Electron or ion microscopes
H01J2237/2602
Details
H01J2237/2605
operating at elevated pressures
H01J2237/2608
with environmental specimen chamber
H01J2237/2611
Stereoscopic measurements and/or imaging
H01J2237/2614
Holography or phase contrast, phase related imaging in general
H01J2237/2617
Comparison or superposition of transmission images Moirè
H01J2237/262
Non-scanning techniques
H01J2237/2623
Field-emission microscopes
H01J2237/2626
Pulsed source
H01J2237/28
Scanning microscopes
H01J2237/2801
Details
H01J2237/2802
Transmission microscopes
H01J2237/2803
characterised by the imaging method
H01J2237/2804
Scattered primary beam
H01J2237/2805
Elastic scattering
H01J2237/2806
Secondary charged particle
H01J2237/2807
X-rays
H01J2237/2808
Cathodoluminescence
H01J2237/2809
characterised by the imaging problems involved
H01J2237/281
Bottom of trenches or holes
H01J2237/2811
Large objects
H01J2237/2812
Emission microscopes
H01J2237/2813
characterised by the application
H01J2237/2814
Measurement of surface topography
H01J2237/2815
Depth profile
H01J2237/2816
Length
H01J2237/2817
Pattern inspection
H01J2237/2818
Scanning tunnelling microscopes
H01J2237/282
Determination of microscope properties
H01J2237/2823
Resolution
H01J2237/2826
Calibration
H01J2237/285
Emission microscopes
H01J2237/2852
Auto-emission (
H01J2237/2855
Photo-emission
H01J2237/2857
Particle bombardment induced emission
H01J2237/30
Electron or ion beam tubes for processing objects
H01J2237/303
Electron or ion optical systems
H01J2237/304
Controlling tubes
H01J2237/30405
Details
H01J2237/30411
using digital signal processors [DSP]
H01J2237/30416
Handling of data
H01J2237/30422
Data compression
H01J2237/30427
using neural networks or fuzzy logic
H01J2237/30433
System calibration
H01J2237/30438
Registration
H01J2237/30444
Calibration grids
H01J2237/3045
Deflection calibration
H01J2237/30455
Correction during exposure
H01J2237/30461
pre-calculated
H01J2237/30466
Detecting endpoint of process
H01J2237/30472
Controlling the beam
H01J2237/30477
Beam diameter
H01J2237/30483
Scanning
H01J2237/30488
Raster scan
H01J2237/30494
Vector scan
H01J2237/31
Processing objects on a macro-scale
H01J2237/3104
Welding
H01J2237/3109
Cutting
H01J2237/3114
Machining
H01J2237/3118
Drilling
H01J2237/3123
Casting
H01J2237/3128
Melting
H01J2237/3132
Evaporating
H01J2237/3137
Plasma-assisted co-operation
H01J2237/3142
Ion plating
H01J2237/3146
Ion beam bombardment sputtering
H01J2237/3151
Etching
H01J2237/3156
Curing
H01J2237/316
Changing physical properties
H01J2237/3165
Changing chemical properties
H01J2237/317
Processing objects on a micro-scale
H01J2237/31701
Ion implantation
H01J2237/31703
Dosimetry
H01J2237/31705
Impurity or contaminant control
H01J2237/31706
characterised by the area treated
H01J2237/31708
unpatterned
H01J2237/3171
patterned
H01J2237/31711
using mask
H01J2237/31713
Focused ion beam
H01J2237/31715
Particle-beam lithography
H01J2237/31716
Production of exposure radiation
H01J2237/31718
Illumination systems for mask or workpiece
H01J2237/3172
Systems for imaging mask onto workpiece
H01J2237/31722
Imaging systems for maskless apparatus
H01J2237/31723
Imaging strategies
H01J2237/31725
Testing and control
H01J2237/31727
Handling mask or workpiece
H01J2237/31728
Alignment of the mask or the workpiece
H01J2237/3173
Constructional details of particle beam apparatus not otherwise provided for
H01J2237/31732
Depositing thin layers on selected microareas
H01J2237/31733
using STM
H01J2237/31735
Direct-write microstructures
H01J2237/31737
using ions
H01J2237/31738
using STM
H01J2237/3174
Etching microareas
H01J2237/31742
for repairing masks
H01J2237/31744
introducing gas in vicinity of workpiece
H01J2237/31745
for preparing specimen to be viewed in microscopes or analyzed in microanalysers
H01J2237/31747
using STM
H01J2237/31749
Focused ion beam
H01J2237/3175
Lithography
H01J2237/31752
using particular beams or near-field effects
H01J2237/31754
using electron beams
H01J2237/31755
using ion beams
H01J2237/31757
hybrid
H01J2237/31759
using near-field effects
H01J2237/31761
Patterning strategy
H01J2237/31762
Computer and memory organisation
H01J2237/31764
Dividing into sub-patterns
H01J2237/31766
Continuous moving of wafer
H01J2237/31767
Step and repeat
H01J2237/31769
Proximity effect correction
H01J2237/31771
using multiple exposure
H01J2237/31772
Flood beam
H01J2237/31774
Multi-beam
H01J2237/31776
Shaped beam
H01J2237/31777
by projection
H01J2237/31779
from patterned photocathode
H01J2237/31781
from patterned cold cathode
H01J2237/31783
M-I-M cathode
H01J2237/31784
Semiconductor cathode
H01J2237/31786
Field-emitting cathode
H01J2237/31788
through mask
H01J2237/31789
Reflection mask
H01J2237/31791
Scattering mask
H01J2237/31793
Problems associated with lithography
H01J2237/31794
affecting masks
H01J2237/31796
affecting resists
H01J2237/31798
detecting pattern defects
H01J2237/32
Processing objects by plasma generation
H01J2237/327
Arrangements for generating the plasma
H01J2237/33
characterised by the type of processing
H01J2237/332
Coating
H01J2237/3321
CVD [Chemical Vapor Deposition]
H01J2237/3322
Problems associated with coating
H01J2237/3323
uniformity
H01J2237/3325
large area
H01J2237/3326
high speed
H01J2237/3327
Coating high aspect ratio workpieces
H01J2237/3328
adhesion, stress, lift-off of deposited films
H01J2237/334
Etching
H01J2237/3341
Reactive etching
H01J2237/3342
Resist stripping
H01J2237/3343
Problems associated with etching
H01J2237/3344
isotropy
H01J2237/3345
anisotropy
H01J2237/3346
Selectivity
H01J2237/3347
bottom of holes or trenches
H01J2237/3348
control of ion bombardment energy
H01J2237/335
Cleaning
H01J2237/3355
Holes or apertures
H01J2237/336
Changing physical properties of treated surfaces
H01J2237/3365
Plasma source implantation
H01J2237/338
Changing chemical properties of treated surfaces
H01J2237/3382
Polymerising
H01J2237/3385
Carburising
H01J2237/3387
Nitriding
H01J2237/339
Synthesising components
Industries
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Patents Grants
last 30 patents
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Issue date
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Issue date
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Issue date
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Industrial Technology Research Institute
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Patent number
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Issue date
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Issue date
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ASML Netherlands B.V.
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Issue date
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Issue date
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Issue date
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NuFlare Technology, Inc.
Haruyuki Nomura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio frequency match network and generator
Patent number
11,961,711
Issue date
Apr 16, 2024
COMET Technologies USA, Inc.
Alexandre De Chambrier
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Plasma processing method and plasma processing apparatus
Patent number
11,961,718
Issue date
Apr 16, 2024
Tokyo Electron Limited
Shojiro Yahata
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Normal-incidence in-situ process monitor sensor
Patent number
11,961,721
Issue date
Apr 16, 2024
Tokyo Electron Limited
Ching Ling Meng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Systems and methods for image enhancement for a multi-beam charged-...
Patent number
11,961,700
Issue date
Apr 16, 2024
ASML Netherlands B.V.
Maikel Robert Goosen
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Charged particle beam system
Patent number
11,961,704
Issue date
Apr 16, 2024
HITACHI HIGH-TECH CORPORATION
Naoki Akimoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor etching methods
Patent number
11,961,773
Issue date
Apr 16, 2024
Ligang Deng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Apparatus using charged particle beams
Patent number
11,961,697
Issue date
Apr 16, 2024
ASML Netherlands B.V.
Xuerang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication of in situ HR-LCTEM nanofluidic cell for nanobubble int...
Patent number
11,961,702
Issue date
Apr 16, 2024
Saudi Arabian Oil Company
Hassan Alqahtani
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
FILM FORMING DEVICE AND FILM FORMING METHOD
Publication number
20240133031
Publication date
Apr 25, 2024
TOKYO ELECTRON LIMITED
Jun YAMAWAKU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD AND SYSTEMS USEFUL FOR PRODUCING ALUMINUM IONS
Publication number
20240136145
Publication date
Apr 25, 2024
Entegris, Inc.
Ying TANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DETECTOR AND METHOD OF FABRICATING SAME
Publication number
20240136462
Publication date
Apr 25, 2024
ASML NETHERLANDS B.V.
Gianpaolo LORITO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TUNGSTEN SUBOXIDE CERAMIC TARGET
Publication number
20240133024
Publication date
Apr 25, 2024
SOLERAS ADVANCED COATINGS BV
Ignacio CARETTI GIANGASPRO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DEPOSITION OF NON-STOICHIOMETRIC METAL COMPOUND LAYER
Publication number
20240133025
Publication date
Apr 25, 2024
SOLERAS ADVANCED COATINGS BV
Wilmert DE BOSSCHER
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BEAM DETECTOR, MULTI-CHARGED-PARTICLE-BEAM IRRADIATION APPARATUS, A...
Publication number
20240136148
Publication date
Apr 25, 2024
NuFlare Technology, Inc.
Yasutaka SATO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR CREATING A SMOOTH DIAGONAL SURFACE USING A FOCUSED ION B...
Publication number
20240136150
Publication date
Apr 25, 2024
APPLIED MATERIALS ISRAEL LTD.
Yehuda Zur
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
A Method for the Simulation of an Energy-Filtered Ion Implantation...
Publication number
20240135066
Publication date
Apr 25, 2024
mi2-factory GmbH
Florian KRIPPENDORF
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
Metallic Shield For Stable Tape-Frame Substrate Processing
Publication number
20240136159
Publication date
Apr 25, 2024
Harish Varma PENMETHSA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS
Publication number
20240136161
Publication date
Apr 25, 2024
LAM RESEARCH CORPORATION
Karl Frederick LEESER
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF
Publication number
20240136153
Publication date
Apr 25, 2024
LAM RESEARCH CORPORATION
Matthew Scott Weimer
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20240136157
Publication date
Apr 25, 2024
SEMES CO., LTD.
Je Ho KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
IMPEDANCE CONTROL OF LOCAL AREAS OF A SUBSTRATE DURING PLASMA DEPOS...
Publication number
20240136160
Publication date
Apr 25, 2024
Applied Materials, Inc.
Zheng John YE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
WAFER PLACEMENT TABLE
Publication number
20240136219
Publication date
Apr 25, 2024
NGK Insulators, Ltd.
Tatsuya KUNO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VERTICAL SEMICONDUCTOR COMPONENT AND METHOD FOR GENERATING AN ABRUP...
Publication number
20240136236
Publication date
Apr 25, 2024
ROBERT BOSCH GmbH
Christian Huber
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PLASMA CONTROL DEVICE AND PLASMA CONTROL METHOD
Publication number
20240136155
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Changho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPUTTERING APPARATUS FOR COATING OF 3D-OBJECTS
Publication number
20240136156
Publication date
Apr 25, 2024
Evatec AG
Stephan VOSER
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
APPARATUS OF PLURAL CHARGED-PARTICLE BEAMS
Publication number
20240128044
Publication date
Apr 18, 2024
ASML NETHERLANDS B.V.
Weiming REN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR OPERATING A MULTI-BEAM PARTICLE MICROSCOPE WITH FAST CLO...
Publication number
20240128048
Publication date
Apr 18, 2024
Carl Zeiss MultiSEM GmbH
Ingo Mueller
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTI-CHANNEL PULSE RF POWER SUPPLY APPARATUS
Publication number
20240128053
Publication date
Apr 18, 2024
AS ENG CO.
HYUK SOO LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE PROCESSING APPARATUS AND SHUTTER
Publication number
20240128058
Publication date
Apr 18, 2024
TOKYO ELECTRON LIMITED
Takashi ARAMAKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR MANUFACTURING FACILITY AND METHOD OF OPERATING THE SAME
Publication number
20240128065
Publication date
Apr 18, 2024
LOT CES CO., LTD.
Jin Ho BAE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET
Publication number
20240124955
Publication date
Apr 18, 2024
MITSUBISHI MATERIALS CORPORATION
Yosuke NAKASATO
B22 - CASTING POWDER METALLURGY
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Patent Application
CAPACITANCE SENSING SYSTEMS AND METHODS
Publication number
20240125832
Publication date
Apr 18, 2024
Advanced Energy Industries, Inc.
Donald Enzinna
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CHARGED PARTICLE APPARATUS AND METHOD
Publication number
20240128043
Publication date
Apr 18, 2024
ASML NETHERLANDS B.V.
Jurgen VAN SOEST
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ROTATABLE TEM GRID HOLDER FOR IMPROVED FIB THINNING PROCESS
Publication number
20240128046
Publication date
Apr 18, 2024
SANDISK TECHNOLOGIES LLC
Xiaochen Zhu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Sample Inspection Apparatus, Inspection System, Thin Piece Sample F...
Publication number
20240128047
Publication date
Apr 18, 2024
Hitachi High-Tech Corporation
Masahiro YOSHIDA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PLASMA CONTROL APPARATUS AND METHOD USING THE SAME
Publication number
20240128054
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Changho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-BEAM CHARGED PARTICLE BEAM SYSTEM WITH ANISOTROPIC FILTERING...
Publication number
20240128051
Publication date
Apr 18, 2024
Carl Zeiss MultiSEM GmbH
Dirk Zeidler
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
APPARATUS FOR PROCESSING PLASMA AND METHOD OF PROCESSING PLASMA AND...
Publication number
20240128055
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Hyunbae Kim
H01 - BASIC ELECTRIC ELEMENTS