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SEMICONDUCTOR PACKAGE
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Publication number 20240145373
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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HYEONGSEOK KANG
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H01 - BASIC ELECTRIC ELEMENTS
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CARRIER STRUCTURE
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Publication number 20240145398
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Publication date May 2, 2024
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Siliconware Precision Industries Co., Ltd.
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Cheng-Liang HSU
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE BONDING METHOD
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Publication number 20240145416
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Wonyoung CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
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Publication number 20240147606
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Publication date May 2, 2024
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Innolux Corporation
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Mu-Fan Chang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240145456
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Publication date May 2, 2024
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Kabushiki Kaisha Toshiba
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Yuichiro NIIKURA
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
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Publication number 20240145255
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Publication date May 2, 2024
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InnoLux Corporation
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Ker-Yih KAO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240145370
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Publication date May 2, 2024
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InnoLux Corporation
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Te-Hsun LIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240145418
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Junghoo Yun
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H01 - BASIC ELECTRIC ELEMENTS
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BONDING STRUCTURE AND POWER DEVICE
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Publication number 20240145426
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Publication date May 2, 2024
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Huawei Digital Power Technologies Co., Ltd.
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Fenglong LU
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H01 - BASIC ELECTRIC ELEMENTS